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White Papers

Modeling Real-World Design Challenges with Modern Vehicle Harness Design Tools Auto makers have long relied on mechanical computer-aided design (MCAD) platforms for their drive train and body design projects. More recently, solutions for harness design have emerged to solve the burgeoning problem of electrical and wiring system complexity. This paper discusses the data and process flows that support a smooth design continuum from engineering to manufacturing. (Apr 29, 2011, Mentor Graphics)

Accurate Harness Costing...in Minutes The ultimate goal of wire harness product engineering is to ensure that harnesses can be manufactured at a competitive and well-understood cost. This paper examines the challenges of achieving that goal. It discusses the three prevailing architectures for costing solutions—automated to varying degrees—contrasting their accuracy and efficiency, and offers perspectives on considerations such as MCAD integration, PDM interoperability, and more. (Apr 29, 2011, Mentor Graphics)

The Coolest Compounds Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today’s electronic circuitry.  In tandem with the great growth of the technological sector comes the need for a new generation of innovative, highly advanced solutions capable of reliable performance in the ever increasing temperatures of electronic devices. Master Bond’s white paper examines the challenges design engineers face as chip makers up the ante on microprocessor power and density, and how thermally conductive adhesives and potting compounds can manage heat while solving other application issues. (Aug 10, 2010, Master Bond, Inc.,)

Understanding Low Outgassing Adhesives Applications that must meet stringent outgassing requirements now have more adhesive options than ever. If you suspect outgassing could potentially pose a problem in your application, specifying adhesives that comply with the ASTM outgassing standard makes sense. Engineers often want to know whether an adhesive is low outgassing or generic. And while there are cases when nothing but a low outgassing product will do, the truth is that many so-called generic adhesives inherently have low outgassing levels. What's more, most bonding, potting, encapsulation and sealing applications don't need to meet a defined outgassing specification. Here's a guide to understanding when low outgassing adhesives are the right choice. (Jun 21, 2010, Master Bond, Inc.,)