The unique combination of high temperature resistance (for lead-free soldering where reflow soldering temperatures exceed 260°C), high flow, low mold shrinkage, high stiffness, and excellent dimensional stability makes LCP (liquid crystal polymer) a favorite choice to meet the future trends of miniaturization in the electronics industry.  LCPs allow high-precision molding for applications such as connectors and sockets with high pin density and ultra-thin part geometries down to 0.1mm wall thickness.

Now designers are challenged even more to insure signal integrity for high frequency / high speed interconnects. As bandwidth demands increase along with package density, there is potential for cross talk and signal degradation.

The webcast will provide a brief overview of LCPs, review Dk/Df of various LCP grades and focus on new, robust material solutions for high-speed connectors and antenna applications.

Edson Ito Technical Marketing Manager Vectra® / Zenite® LCP, Ticona Engineering Polymers

Ticona, the global leader in LCP for consumer electronics, knows high-performance E/E components and what it takes to help make your business more productive and more competitive in a dynamic marketplace. As a solutions-driven company, Ticona continues to develop new engineering polymers that help customers gain a competitive advantage in the design and production of electronic components. With its portfolio of “Engineering Polymers for Green Electronics,” Ticona provides solutions for the most demanding requirements. This portfolio includes key high-performance, high-temperature engineering polymers - Vectra® and Zenite® LCP, Fortron® PPS and Thermx® PCT - as well as V-0 Halogen-free Celanex® XFR® PBT and Riteflex® XFR® TPC-ET. Ticona provides a global support network of materials experts at production, compounding and research facilities in the USA, Germany, Brazil and China.

http://www.ticona.com

Ticona North American Headquarters
8040 Dixie Highway
Florence, KY 41042
U.S.A.

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