The 2010 IWCS/IICIT Conference is now accepting abstracts for presentation of new and original technologies in wire, cable, and connectivity.
The Fiber Optics LAN Section (FOLS) of the Telecommunications Industry Association (TIA) has elected its slate of officers for 2010.
The certification signifies that EI’s assembly and test of PC boards and semiconductor packages meets the requirements for suppliers to medical device manufacturers.
The IEEE Standards Association (IEEE-SA) is offering this seminar as part of a full outreach program in India.
TIA TR-42 and its thirteen subcommittees develop standards for copper and optical fiber cabling infrastructure used in commercial, residential, and industrial buildings, as well data centers.
The recently ratified PICMG 2.30 CompactPCI Plus IO standard specifies the fully shielded Ultra Hard Metric (UHM) Socket Connector from 3M as the high-speed J2 connector.
Endicott Interconnect Technologies, Inc. (EI) announced today that its Endicott, NY facility has been awarded Nadcap accreditation in accordance with SAE Aerospace Standard AS7003 for electronics.
SAE International has released a standard that provides a standard interface between plug-in hybrid and battery-electric vehicles, and electrical charging systems.
Complying with new proposed iDP interface standard, the new bridge chipsets from ST may enable cost and time-to-market savings for TV manufacturers.
Introduced at the 2010 International CES, DisplayPort v1.2 doubles the performance of the existing standard, and provides for multi-monitor support over a single connector, as well as optional bi-directional data transport supporting USB 2.0 and Ethernet and support for the Mini DisplayPort connector.
