The manufacturer's electronics group has signed two new representatives to support its sales in Northern California and the Texas/Oklahoma region. The firms are Moore Integrated Technologies and The NiMar Group, respectively.
E-tec intros FastLock sockets(Jul 6, 2009) July 6, 2009--E-tec Interconnect's FastLock socket retention system is designed for BGA, LGA, QFN, and Gullwing chip sockets, and is available in SMT/Thru-hole and solderless versions.
Sullins intros IDC socket, plug series(Jul 6, 2009) July 6, 2009--Sullins Connector Solutions has added a 2.54-mm contact centerline SFH IDC Series socket and SIP IDC Series DIP plugs. The devices are designed to quickly mass-terminate single-layer (1.27-mm) 28 AWG flat ribbon cable.
Suyin intros automatic placement packaging(Jun 25, 2009) June 25, 2009--Suyin is offering packaging solutions for standard and customized components designed for automatic/robotic placement, allowing electromechanical components to be picked up quickly and precisely from a defined position.
Master Bond debuts nanosilica-filled epoxy(Jun 16, 2009) June 16, 2009--Master Bond Inc.'s UV22 is a nanosilica reinforced, UV curable epoxy system. The nano-sized filler (<50 nm) is designed to give the cured system exceptional abrasion resistance, optical clarity, physical strength properties, and low shrinkage, plus low viscosity of 4,000 cps. The tensile strength of the cured epoxy is greater than 4,600 psi and its tensile modulus is greater than 500,000 psi.
Zinc nickel-plated connectors earn mil listing(Jun 9, 2009) June 9, 2009--Souriau´s new range of 38999 series III connectors, plated with RoHS-compliant black zinc nickel, has
received a Qualified Product Listing (QPL) from the DSCC (Defense Supply Center, Columbus). This plate, says Souriau, is the only RoHS-compliant alternative to cadmium.
Positronic adds D-sub closed-entry contacts(Jun 2, 2009) June 2, 2009--Positronic's PosiBand closed-entry female contact often used in D-subminiature connectors is designed to overcome weaknesses associated with the "split tine" and sleeve approach. PosiBand separates the mechanical and electrical function of the contact system. The base contact provides a true closed entry feature and enhanced electrical stability, while the spring clip provides more stable mechanical function.
Henkel solder targets BGAs(Jun 1, 2009) June 1, 2009--Henkel's Multicore LF700 lead-free, halide-free solder paste is designed to reduce voiding in BGA solder joints. The company says the materials provides stability during high-speed component placement and offers long printer abandon times of up to four hours "even when printed onto extremely fine-pitch 0.4mm CSP apertures."
Henkel develops low-temp cure underfill(May 26, 2009) May 26, 2009--Henkel's Hysol UF3800 underfill has been designed for use with CSP and BGA devices, particularly handheld communication and entertainment applications. The company claims Hysol UF3800 "flows fast at room temperature and cures quickly at low temperature." In addition, the material is reworkable, which can improve final yield while reducing scrap.
