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Download a printable version of the Interconnection Glossary. Select from the following: |
Numbers & Misc. | A B C D E F G H I J K L M N O P Q R S T U V W X Y Z | |
L
L1 and L2 | Level 1 and Level 2 memory caches in a computer |
L2F Protocol | Layer Two Forwarding Protocol |
L2TP | Layer Two Tunneling Protocol |
LAA | Longest Available Agent |
LAC | L2TP Access Concentrator |
LAI | Location Area Identity |
LAN | Local Area Network |
LANE | LAN Emulation |
LANE UNI | LANE User-Network Interface |
LAP | Link Access Procedure; Local Access Provider |
LAPB | Link Access Protocol/Procedure Balanced |
LAPD | Link Access Protocol/Procedure on the D Channel |
LAPM | Link Access Protocol/Procedure for Modems |
LASER | Light Amplification by Stimulated Emission of Radiation |
LAT | Local Area Transport |
LATA | Local Access and Transport Area |
LBS | Location-Based Services |
LCA | Local Calling Area |
LC-ATM | Label-Controlled ATM interface |
LCD | Liquid Crystal Display |
LCI | Logical Channel Identifier |
LCN | Logical Channel Number |
LCP | Link Control Protocol |
LCR | Least Cost Routing |
LCV | Line Code Violation |
LD | Long Distance |
LDAP | Lightweight Directory Access Protocol |
LDCELP | Low-Delay CELP |
LDIF | LDAP Data Interchange Format |
LDP | Label Distribution Protocol |
LDS | Local Digital Switch |
LEAP | Lightweight Extensible Authentication Protocol |
LE_ARP | LAN Emulation Address Resolution Protocol |
LEC | Local Exchange Carrier |
LEC BAN | Local Exchange Carrier Billing Account Number |
LECS | LAN Emulation Configuration Server |
LED | Light-Emitting Diode |
LED Node | Low-Entry Networking Node |
LEO | Low Earth Orbit |
LERG | Local Exchange Routing Guide |
LES | LAN Emulation Server |
LES | Loop Emulation Services |
LFIB | Label Forwarding Information Base |
LFSR | Linear Feedback Shift Register |
LGN | Logical Group Node |
Linux | A contraction of “Linus’ Unix” |
LIS | Logical IP Subnet |
LL | Leased Line |
LMDS | Local Multipoint Distributed Service |
LMI | Local Management Interface |
LNA | Low Noise Amplifier |
LNP | Local Number Portability |
LNS | Phone lines, “#LNS” means number of lines |
LOF | Loss of Frame |
LOS | Line of Sight; Loss of Signal |
LPC | Linear Predictive Coding |
LRC | Longitudinal Redundancy Check |
LSB | Least Significant Bit |
LSO | Local Serving Office |
LSP | Link-State Packet |
LSU | Logical Storage Unit |
LT | Line Termination |
LTU | Line Termination Unit |
LULT | Line Unit LT |
Lacing Cord or Twine | Used for lacing and tying cable forms, hook-up wires, cable ends, cable bundles and wire harness assemblies. Available in various materials and impregnants. |
Lambertian Radiator | An optical source that has radiance uniform in all directions, proportional to the cosine of the angle from the normal. |
Land | Portion of a conductive pattern usually, but not exclusively, used for the connection and/or attachment of components. (Also called Pad, Boss, Terminal Point, Blivet, Tab, Spot or Donut.) |
Lanyard | A device attached to certain connectors that permits uncoupling and separation of connector halves by a pull on a wire or cable. |
Lap Joint | Two conductors joined by placing them side-by-side so that they overlap. (See Parallel Splice.) |
Laser | Acronym for Light Amplification by Stimulated emission of Radiation; a device that transmits an extremely narrow and coherent beam of electromagnetic energy in the visible light spectrum. |
Laser Soldering | A selective soldering technique employing a programmable laser system. The laser soldering system is effective for high-volume selective soldering of wire wrapping pins to backplanes, power planes and PC boards. |
Lasing Threshold | The lowest excitation level at which a laser’s output is dominated by stimulated emission rather than spontaneous emission. |
Lateral Offset Loss | An optical power loss caused by transverse or lateral deviation from optimum alignment of source to optical fiber, fiber-to-fiber or fiber-to-detector. |
Launch Angle | The angle between the ray and the optical axis of an optical or fiber bundle. |
Lead | A wire, with or without terminals, that connects two points in a circuit. |
Lead Frame | A metal frame, including the leads of a plastic encapsulated DIP package; the frame holds the leads in place prior to encapsulation and is cut away after encapsulation. |
Levels of Interconnection | Device to board or chassis: The connection point between components (tubes, transistors, lC packages) and the PC board or chassis. Board to motherboard or backplane: The connection point between PC boards or sub-circuit modules and the motherboard or a backplane board. Backplane wiring: Connections between levels to each other and to other subcircuits. Input/output: Connections for power and signals into and out of a system. Connections may be between subassemblies within the same endosure or between individual units. |
Life Cycle | A test that indicates the time span before failure; the test occurs in a controlled, usually accelerated, environment. |
Light | In a strict sense, the visible spectrum, nominally covering the wavelength range of 400 to 750 nm. |
Light Emitting Diode (LED) | A semiconductor device that emits incoherent light from a p-n junction (when biased with an electrical current). Light may exit from the junction strip edge or from its surface (depending on the device’s structure). |
Line Impedance | Impedance measured across the terminals of a transmission line. |
Liquidus | Temperature at which an alloy is completely molten. (See Solidus.) |
Live-Line Connector | A connector that may be installed or removed by means of an insulated slick while the conductor is energized. (Also called Hot-Line Clamp.) |
Loadbreak Connector | A connector designed to close and interrupt current on energized circuits. |
Local Area Network (LAN) | A network that is located in a localized geographical area (e.g., an office, building, complex of buildings or campus) and whose communications technology provides a high-bandwidth, low-cost medium to which many nodes can be connected. |
Locator | Device for positioning terminals, splices or contacts in crimping dies. (See Stop Plate.) |
Locking Spring | Device, located on the contact or in the insert, that retains the contact in an insert or body. (Also called Contact Retainer.) |
Long-Haul Network | A network most frequently used to transfer data over distances of from several thousand feet to several thousand miles. |
Longitudinal Indent | An indent shape where the longest dimension is in line with the connector barrel. |
Loop Resistance | The total resistance of two conductors measured round-trip from one end (twisted pair, shield and conductor, etc.). |
Loss | (1) Energy dissipated without performing useful work. (2) A decrease in power suffered by signal as it is transmitted from one point to another (transmission loss). |
Loss Factor | The loss factor of an insulating material is equal to the product of its dissipation and dielectric constant. |
Low Energy Surface | A soft solid with low melting point having surface-free energies below 500 ergs/cm2. (See High Energy Surface.) |
Low Loss Dielectric | A low loss dielectric is an insulating material, such as polyethylene, that has a relatively low dielectric loss, making it suitable for transmission of radio frequency. |
Lug | A wire terminal. |
Numbers & Misc. | A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
