NEWS - Connector Specifier

NEWS


Apr 1, 2001

W.L. Gore, Agilent, Mitel Agree to Standard

NEWARK, Del. — W.L. Gore & Associates Inc., Agilent Technologies Inc. (Palo Alto, Calif.) and Mitel Semiconductor (Kanata, Ontario, Canada) have signed a multi-source agreement (MSA) for next-generation parallel fiber optic modules.

The three companies have leveraged their experience in fiber optic and semiconductor technologies to standardize the package and optical and electrical interfaces for their respective modules to ensure that customers will have access to multiple international sources that are compatible with other components within their systems. Each of the companies expects to offer the modules in 2001.

Designed for a variety of fiber optic communications applications, the parallel fiber optic modules include transmitters and receivers featuring 12 channels at 1.0 to 2.7 Gbaud per channel for an aggregate bandwidth of 12.0 to 32.4 Gbaud. The modules are designed to meet skyrocketing demand for network capacity in proprietary terabit switch/router links as well as very short-reach OC-192 and InfiniBand connections.

Performance of single-fiber and copper interconnects is limited in terms of bandwidth, density and distance. Network system manufacturers are finding that parallel fiber modules are the best and, in many cases, the only method of equipment interconnection. The new modules can support transmission requirements of greater than 30 Gbaud while utilizing less than 2.0" of board space for a Tx/Rx pair. The transmitter and receiver are compatible with an industry-standard MTP/MPO-terminated parallel fiber optic interconnect. (MTP is a registered trademark of US Conec.) Product design, development, manufacturing, marketing and distribution of the parallel fiber optic modules will take place independently.

Pete Widdoes, Business Leader for W.L. Gore's Parallel Optic Data Links, stated, "We believe our customers will find this MSA product to be very attractive. The performance specs provide for a robust link budget and the ball grid array or land grid array interface assures compatibility with high-volume manufacturing lines. Additionally, the customers will benefit from the security of supply afforded by the combined capacity of multiple manufacturers."

"This agreement is a win for each of the signing companies, and for our respective customers," said Tom Fawcett, Agilent's Marketing Manager for Optical Systems Interconnects. "We gain the ability to drive this common package and interface specification as the industry standard for 12-channel parallel optics modules. Our customers gain flexibility and the advantages of competitive sources."


Molex and Mobility Electronics Sign Licensing Agreements

LISLE, Ill. — Mobility Electronics Inc. (Scottsdale, Ariz.) has signed a licensing agreement to use interconnect technology from Molex Inc., including its low-force helix connectors and related high-speed digital interconnect technologies. Molex holds patents on low-force helix connectors, which are an important component for Mobility's split-bridge technology and universal docking solution (UDS). This licensing agreement gives Mobility the exclusive right to use low-force helix connectors in split-bridge and UDS applications, and provides the structure for continued development of the interface technology for other split-bridge applications.

This licensing agreement also gives Mobility the right to sublicense other cable manufacturers to make low-force helix connectors and cable assemblies for UDS and cable docking. Molex also committed to immediately supporting the development of a range of UDS connectors and cable assemblies. Initial prototype cable assemblies and connectors are already available from Molex for developing cable docking solutions with split-bridge and digital video interface (DVI) technologies.

The UDS is an emerging connectivity standard for expansion and universal docking that is being pioneered by Mobility, Molex, Silicon Image Inc. (Sunnyvale, Calif.) and LSI Logic Corp. (Milpitas, Calif.). It combines the power of universal serial bus (USB), split bridge, DVI and analog video in one small interface that can replace numerous connectors on portable computers. Split-bridge technology allows the extension of a computer's main peripheral computer interface (PCI) bus to a remote location. With bidirectional bandwidth of 1.25 Gbps, split-bridge technology is 100 times faster than USB technology today.


Markets Driving Connector Demand

ST. CHARLES, Ill. — Next-generation optical network equipment accounted for $650 million in connector consumption in 2000, up 20 percent over the previous year. Bishop & Associates Inc. forecasts that connector consumption within this sector will reach $1.3 billion in 2004, representing a five-year average annual growth rate of 19 percent.

Optical network equipment includes synchronous optical network (SONET) transport equipment, digital cross-connects, dense wavelength division multiplexing (DWDM) equipment, optical cross-connects, terabit switch/routers, multi-service access concentrators, digital subscriber line (DSL), passive optical networks (PONs), 1/10 Gigabit Ethernet, Fibre Channel and optical components. Together, this set of equipment comprises the foundation of an optical network infrastructure for the next century that will make bandwidth available as an unrestricted resource, not only in the network core but also in metropolitan and access networks as well as within the customer premises.

Enabling this next generation of equipment are advances in electronic packaging and interconnection technology, as well as advances in the optical components arena. High-performance electrical backplane interconnect systems, optical backplanes and small form factor connectors are among the new tools equipment designers are using to break traditional transmission throughput and scalability barriers. Go to www.connectorindustry.com for more information.


Total world value of connector shipments: optical network equipment ($ millions)
Click here to enlarge image

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CompactPCI Market Leaders Collaborate

SAN DIEGO — The StarFabric Working Group, a group of leading communications industry companies exploring next-generation technologies compatible with CompactPCI, have disclosed their activities and plans for 2001. The working group companies share a common vision of the need to build on the success of CompactPCI in the communications market in order to meet critical customer requirements for next-generation equipment.

The working group is utilizing Marlborough, Mass.-based StarGen Inc.'s universal switch fabric technology as the basis of proof-of-concept designs intended to illustrate various communications system solutions. StarGen's switch fabric is a high-speed, point-to-point backplane and chassis-to-chassis interconnect solution. Each proof-of-concept design will demonstrate how switch fabric-based systems can address critical requirements including system scalability, flexibility, high availability and quality of service while maintaining compatibility with existing CompactPCI architectures.

"The CompactPCI standards have provided the foundation for a dynamic and growing market for open communication platforms. Efforts like those of the StarFabric Working Group ensure that the CompactPCI architecture will continue to evolve in a compatible way to meet new and challenging market requirements. This type of evolution can open up and expand market opportunities for the entire CompactPCI community," said Joe Pavlat, President of the PCI Industrial Computer Manufacturers Group (PICMG).

Companies participating in the working group are taking a lead in this process by investing in the development of proof-of-concept designs and functional prototypes for demonstration starting in April. The StarFabric Working Group intends to open the technology specification to the industry so all vendors can create compatible and interoperable products with no royalty or license fees.


PLACES & FACES...

Methode Electronics Inc. announced that William T. Jensen, Donald W. Duda and Robert R. McGinley have been elected as Class B Directors to the Board of Directors. Duda was also elected by the Board of Directors as the company's President, effective immediately. Jensen will serve as Methode's interim Chairman of the Board, replacing William J. McGinley, who passed away in January 2001.

Frederick M. Noblett, Jr. has been named President of Weidmüller Inc. (Richmond, Va.). Noblett brings more than 20 years of experience in industrial automation to this position. Weidmüller also formed a strategic partnership with ECT International Inc., a developer of control system design software based in Brookfield, Wis.

Wieland Electric Inc. (Burgaw, N.C.) announced the promotion of Bruce Burroughs to the position of Product Group Manager, reporting directly to the president. Burroughs will supervise all product managers and application engineers, while maintaining responsibility for the PCB product group. Wieland has also appointed Doug Terhune as Distributor Sales Manager for the U.S. division. Terhune's responsibilities include conducting product training, promotions and incentive programs, as well as overseeing sales and budgets.

Phoenix Contact Inc. (Harrisburg, Pa.) has promoted Scott McLendon, Alan Ringhoffer and Mark Stevens to Vice President of Sales, Distribution, and Marketing & Communications, respectively. McLendon joined Phoenix Contact in 1996 as National Sales Manager. Ringhoffer has been with the company since 1994 and formerly held the positions of Product Marketing Manager and Director of Distribution. Stevens joined Phoenix Contact in 1991 and previously held the positions of Product Marketing Manager and Director of Marketing.

Germantown, Wis.-based WAGO Corp. has promoted Robert Mehalick to Marketing Manager. Mehalick's responsibilities include maintaining a marketing campaign and developing strategies for market presence. WAGO also has promoted James J. Bachle to Electrical Products Manager. Bachle will work with the sales and marketing staff to train, promote and assist in the development of new electrical products.

Neutrik AG, based in Schaan, Liechtenstein, announced the retirement of Bernhard Weingartner as Chairman of the Board. Weingartner founded Neutrik in 1975 and began operations with two people out of a barn. Today, Neutrik's connector products are used in the music, broadcast, touring and installed sound industries.

Cooper Industries Inc. (Houston, Texas) has announced changes to its executive management structure. Ralph E. Jackson was promoted to COO, Terry A. Klebe was named Chief Information Technology Officer and David A. White, Jr. was appointed Venture Development Officer.

Milwaukee, Wis.-based HellermannTyton has acquired RW Data (Northampton, United Kingdom), a manufacturer of structured cabling systems for voice and data. The voice/data products will be marketed under the HellermannTyton name.

Pomona, Calif.-based Everett Charles Technologies has promoted Michael Elsässer to European Sales Manager for Pogo contacts and test fixtures. Elsässer has been with the company for over three years in the role of Regional European Sales Manager.


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