At the 2011 Medical Electronics Symposium, held Sept. 27-28 at Arizona State University, Tempe Campus, Zarlink Semiconductor delivered a presentation discussing innovative packaging technologies developed to help shrink the size of electronic components used in implanted and on-body medical devices.
The presentation, entitled Disappearing Die - The TIPS Project, was led by Martin McHugh, business development manager with Zarlink's Advanced Packaging group. The discussion centered on Zarlink's involvement in the TIPS (Thin Interconnect Package Stack) Project and the successful creation of new processes to integrate complex electronics, such as processors, memories and radios, into ultra-thin stacked packages with a maximum layer thickness of 0.10 millimeters (mm).
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"Miniaturization, wireless communication and ultra low-power consumption are key factors for device manufacturers designing smaller and lighter implanted and on-body products supporting advanced therapies," said Steve Swift, Vice President and General Manager of Zarlink's Medical Products Group.
Swift added, "Highly integrated packaging technologies developed through the TIPS Project distinguish Zarlink as we work with medical equipment manufacturers to simplify design of new products and therapies aimed at improving patient comfort and care."
More Info: www.zarlink.com
