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ITT Interconnect Solutions has designed a new highly reliable dry circuit lead contact for handheld devices. The manufacturer says its rugged Dome Spring Contact (DSC) Series connector provides a high Hertz force of 300K psi with a maximum contact force of 0.5N.
ITT says the DSC Series connector features a simple design that delivers a strong and stable spring rate, as well as board design flexibility. The connector's design eliminates the risk of flux and solder migration into the contacts' working area, while being pick-and-place compatible, according to the company.
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"The Dome Spring Contact Series devices are a robust interconnect that has never experienced an in-field failure," comments Ted Worroll, product manager at ITT Interconnect Solutions. "Not only does the DSC Series offer manufacturing forgiveness and freedom of board positioning, but the interconnect also provides a long operating life, even when exposed to harsh environmental conditions found in portable electronic applications."
Available in a variety of contact forces and a working height range of 0.9mm to 4.5mm, the DSC Series features a high interconnect mating cycle of 3,000. The 2amp nominal current contact is manufactured with BeCu (Beryllium Copper) or TiCu (Titanium Copper), which offers an inherently low contact resistance. The DSC Series devices are intended for consumer electronic applications including smart phones, handsets, GPS units, laptops computers, PC card devices, smoke detectors, and home electronics devices.
