Low-cap silicon ESD devices boost signal integrity in consumer, mobile interconnects - Connector Specifier

Low-cap silicon ESD devices boost signal integrity in consumer, mobile interconnects


Feb 9, 2012

TE Connectivity's (NYSE: TEL) TE Circuit Protection business unit has introduced a series of eight single-channel and multi-channel silicon ESD (SESD) protection devices that the company claims offer among the lowest capacitance (bi-directional: 0.10pF typical; uni-directional: 0.20pF typical), highest ESD protection (20kV air and contact discharge) and smallest size packages (multi-channel: smallest flow-through form-factor and 0.31mm height) available on the market today.

TE says the ultra-low-capacitance, small size and high ESD kV rating of the SESD devices make them well-suited for use in smart phones, HDTVs and similar consumer, automotive and other markets’ products using high speed interfaces such as USB 3.0/2.0, HDMI, eSATA, DisplayPort, and Thunderbolt. The devices’ ultra-low-capacitance results in ultra-low insertion loss, which is essential for maintaining signal integrity in ultra-high-speed applications.

Designed to help protect against damage caused by ESD, surge and cable discharge events, the multi-channel devices also feature a flow-through design package that allows for matched impedance of PCB trace routing, which is essential for maintaining high-speed signal integrity.

Related Coverage:  TE issues circuit protection product catalog

The single- and multi-channel SESD devices also feature a 20kV contact and air discharge rating, exceeding IEC61000-4-2’s 8kV industry standard. In the event of a high voltage ESD strike, this high kV rating helps minimize the risk of the ESD device failing short and permanently disabling the port, or open, exposing the downstream chipset to damage caused by another ESD strike.

“ESD protection devices add capacitance on data lines, which in turn can cause signal integrity issues that hamper a product’s performance and interoperability," comments Patrick Hibbs, Global Strategic Marketing and ESD Business Manager for TE Circuit Protection. "Today’s high-speed ports need the lowest-capacitance ESD devices available to provide the highest degree of protection while having minimal effect on signal transmission."

Hibbs adds, “Our new SESD devices offer capacitance that is up to 92% lower than competing ‘ultra-low-capacitance’ solutions. This means our SESD devices are ready for Thunderbolt applications today. And even though the 4K ultra-high-definition (UHD) and quad high-definition (QHD) TV markets are still emerging, our SESD devices are ready for these applications as well.”

TE says the SESD devices also offer size advantages in the ongoing trend for miniaturization of consumer devices. The single-channel devices are available in 0201-sized XDFN small footprint (0.6mm x 0.3mm x 0.31mm) and 0402-sized XDFN (1.0mm x 0.6mm x 0.38mm) packages. The multi-channel SESD arrays (two-, four- and six-channel options) feature a package height as low as 0.31mm– resulting in up to a 50% lower profile than comparable devices.

The company says the SESD devices’ lower profile allows for placement closer to the edge of the PCB, or in-between boards and connectors, facilitating design flexibility. Additionally, one miniature four-channel SESD array can be used in a smaller board area than four 0201 devices, claims TE; featuring ultra-small 4- and 6-channel flow-through arrays, the new devices also ease routing when used with applications employing miniature-size connectors, such as HDMI Type-D, mini DisplayPort, Thunderbolt and USB 3.0 Micro-B.

The SESD product family specifications include:

SESD0201X1BN-0010-098: 1-channel, bi-di, 0.10pF cap., 20kV rating, 0201 package
 
SESD0402X1BN-0010-098: 1-channel, bi-di, 0.10pF cap., 20kV rating, 0402 package
 
SESD0201X1UN-0020-090: 1-channel, uni-di, 0.20pF cap., 20kV rating, 0201 package
 
SESD0402X1UN-0020-090: 1-channel, uni-di, 0.20pF cap., 20kV rating, 0402 package
 
SESD0402Q2UG-0020-090: 2-channel, uni-di, 0.20pF cap., 20kV rating, 0402 3L package
 
SESD0802Q4UG-0020-090: 4-channel, uni-di, 0.20pF cap., 20kV rating, miniature array package
 
SESD1004Q4UG-0020-090: 4-channel, uni-di, 0.20pF cap., 20kV rating, standard array package
 
SESD1103Q6UG-0020-090: 6-channel, uni-di, 0.20pF cap., 20kV rating, miniature array package

Unit pricing for the devices starts at $0.16 for 10,000 unit quantities; delivery is 12 weeks ARO.

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TE Circuit Protection's SESD device family provides ultra-low insertion loss for highest speed mobile and consumer interfaces including USB 3.0/2.0, HDMI, eSATA, DisplayPort, and Thunderbolt technology.

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