TOKYO -- Sony Corporation announced that it has developed 'single wire interface technology', a hybrid transmission technology which facilitates both data and power transmissions through a single cable. The technology enables the internal wiring of a mobile device to be streamlined through a single copper wire.
Conventionally, the video, audio and control signals as well as the power transmission were spread out over several dozen cables within the movable mechanisms of mobile devices, such as hinges or rotating parts. Sony aims to promptly implement the new technology to improve design flexibility, reliability and durability for mobile devices with movable mechanisms.
In recent years, mobile devices have become ever more sophisticated in terms of advanced functionality and high resolution displays. As a result, more wiring connections have been used to accommodate the increasing volume of data being transmitted within devices. Accordingly, new problems began to emerge as connectors in devices became larger and it became more difficult to bend the connecting cables.
Sony's 'single wire interface technology' has achieved bi-directional transmission of several kinds of signals, including video, audio and control signals, by using time division duplex and multiplex. In addition, the DC power is supplied on the same signal cable. Sony's proprietary encoding technology with DC balance enables both DC power supply and high speed data to be transmitted within a limited frequency bandwidth.
In order to swiftly begin practical implementation of this technology, Sony has teamed up with ROHM Co., Ltd., which has a track record in peripheral technologies, for the joint development and technical validation for the analog portion of the test chip. Hereafter, Sony will grant ROHM a license for the IP of the digital portion of this newly-developed technology in order to advance the development of a single chip which includes both the analog and digital portions.
For more information, go to www.sony.net.
