LISLE, Ill. -- January 14, 2010 -- Molex Inc. announced a new addition to its EdgeLine family of connectors. The EdgeLine CoEdge Connector, which was recently nominated as a DesignVision finalist at the upcoming DesignCon 2010 show, is a one-piece, 25 Gbps connector that is configured to meet an industry standard pitch of 0.80mm (.031”). This low-profile, dual-sided, edgecard connector supports sixteen PCB thickness variations with multiple circuit sizes for high-speed, industry-standard, edgecard applications.
“Similar to our other EdgeLine products, the CoEdge delivers a low-cost, flexible and scalable solution for low-to-mid range telecom, computing and storage applications,” said Adam Stanczak, product manager, Molex Incorporated. “In addition, CoEdge’s unique contact configuration is versatile and can be used in a wide range of system architectures.”
The CoEdge connectors ensure PCBs are aligned at the centerline to allow for a uniform signal path across the length of the connector. Keying and locking features are provided to secure the connector to the PCB and improve board alignment during mating. Application tooling is not needed, allowing for easy board installation.
In addition to the CoEdge, Molex offers the following EdgeLine products to meet a wide range of interconnect needs:
* The EdgeLine one-piece, press-fit, low-cost connectors support high-speed signal transmissions using a card-edge interface via a vertical or right-angle insertion.
* The EdgeLine Edgecard Connectors have the capability to optimally manage slower speed single-ended and power circuits with a low profile off of the PCB to aid in airflow for system cooling.
* The EdgeLine Signal Power (ESP) Connectors deliver a single-piece solution for high-speed and high-power telecom, computing and storage applications with 30.0A power per blade.
Molex will be showcasing its EdgeLine high speed connectors at DesignCon, Booth 509, February 2 and 3, 2010. For more information visit www.molex.com/link/edgeline.html.
