This solder application system is said to combine timed-pulse dispensing with a prepackaged solder paste for faster, more precise application than flux-core wire. SolderPlus is a flux/alloy mixture specifically designed for manual or air-powered dispensing equipment. Prepackaged in 35 and 75 g barrels, it reportedly does not clog, skip or separate. Deposit size is controlled by the dispenser, which features a 0.01 to 1.0 second timer and 0 to 60 psi air regulator.
EFD Inc.
East Providence, R.I.




