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Developed to provide design flexibility in three planes, FleXYZ interfaces are said to achieve high density by specifying the numbers of rows, pins per row and board spacing with standard interconnects. Headers, board stackers, sockets and self-nesting sockets are available. Also available are up to 310 pins/in2 on 0.050" pitch with BGA processing compatibility. Optional attached solder balls reportedly optimize reflow soldering.
Samtec
New Albany, Ind.
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Testing the Boeing 787 Dreamliner's in-flight entertainment systems
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