The Macromelt Molding System is a low-pressure, insert-molding technology that uses high-performance thermoplastic polyamides for electronics molding, potting and encapsulation. These polyamides are said to exhibit low viscosity when melted, thereby allowing low-application pressures that will not damage or displace sensitive electronic components. Features include adhesion to a variety of plastics and metals, creating moisture and environmental seals, and simplified mold design.
Henkel Adhesives
a Henkel Corp. Group
Elgin, Ill.
