These BGA-to-BGA adapters can be used to convert difficult-to-assemble fine-pitch BGAs to footprints that are said to be more compatible with standard manufacturing processes. They also can be used to isolate the fine-pitch, high-performance components from the motherboard, allowing motherboard layer count to be kept to a minimum. The company offers assembly of the BGAs to the adapter so that handling is limited to a single component, which is compatible with automated placement equipment.
Interconnect Systems Inc. (ISI)
Camarillo, Calif.
