These micro high-speed interfaces are said to offer design flexibility. They are impedance-matched systems with low crosstalk, and they provide testing for impedance, VSWR, attenuation, crosstalk, propagation delay and rise time at frequencies from 10 MHz to 1 GHz. The integral ground planes are soldered to the PCB in multiple points for electrical and mechanical performance. Choices include 0.5 mm pitch with up to 300 I/Os or 0.8 mm pitch with 200 I/Os.
Samtec
New Albany, Ind.




