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TE Connectivity (NYSE: TEL) has introduced what it bills as a sleek, one-piece compressive board-to-board connector that enables connecting to a gold-plated secondary board by compression of the contacts. TE says that this connector, adopted by major mobile device manufacturers, is scalable in a number of positions, height and pitch, to enhance design flexibility.
The new compressive board-to-board connector, made of high temperature thermal plastic and copper alloy, includes dimples on the contact area and features preloaded contacts, which are protected from damage that can occur through accidental contact lifting. The 0.08mm co-planarity over all solder tails further reduces solder paste thickness, allowing for greater accuracy and expanded applications. The products are packaged in embossed tape to allow for automatic pick and place operations, helping to reduce manufacturing costs and lead time.
With a sleek design, scalability and optimization for automated production, the first-generation one-piece board-to-board connector connects the main PCB board with secondary PCB boards -- making it ideal for use in mobile devices, cameras, handheld GPS, etc., according to the company. For more information on the new board-to-board connector from TE, visit: http://www.te.com/en/industries/mobile-devices.html?s_cid=con_con_te_var_oth_FY12CDBtBOPR_PR
