Samtec announced that it will participate in the DesignCon 2011 conference and exhibition, featuring three new products and a 40-minute paper session on advanced transmission lines for improved signal integrity.
Samtec products on display at the show will include:
-- The company's Eye Speed HD (HDLSP, HDC Series), an ultra-dense I/O cable system offering superior signal integrity with HyperTransport HT 3.1 performance and 32 AWG low skew pair cable. Designed for heavy-duty handling, Eye Speed HD is equipped with a rugged latching system and shielded for EMI protection.
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-- Samtec’s line of high speed, high density SEARAY open pin field arrays, now available in a right angle design that is ideal for micro backplane applications and press fit tail options with up to 500 I/Os and optional rugged features.Also in development is a 0,8mm (.0315”) micro pitch SEARAY interconnect (SEAM8/SEAF8 Series) that uses 50 percent less board space while providing the same grounding and routing flexibility as the 1,27mm (.050”)pitch arrays.
-- Available in board-to-board and cable-to-board interconnect solutions, the Edge Rate contact system is designed to optimize signal integrity in rugged applications, offers superior impedance, and reduces broadside coupling.
Samtec notes that it received a 2010 DesignVision Award in the Interconnect Technologies and Components category for its Bull’s Eye high performance, low cost test system. Visit the company at Booth 215 during the DesignCon 2011 show or go to www.samtec.com/designcon for more information.
