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Henkel recently developed Hysol Eccobond CA3556HF, which is a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. Henkel says the material is ideal for high-throughput production processes and applications that dictate high peel strength, including assembly of photovoltaic modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.
According to Henkel, solder's high-temperature requirements make it impractical for some applications. Plus, fragile, thin and/or temperature-sensitive substrates are often subject to damage not only from soldering temperatures, but also from screen and stencil printing processes. Henkel positions Hysol Eccobond CA3556HF as a solution in these applications.
Henkel's global product manager for pastes and inks Vito Buffa explains the material "also has advantages over other electically conductive adhesives that burden users with long cure times and limited flexibility."
He adds that other benefits include high peel and shear strength, stress minimization properties to compensate for coefficient of thermal expansion (CTE) mismatches, fast cure for high throughput, and a no-mix one-part formula that reduces operator error and speeds processing time.
