Chicago – January 12, 2010 – The International Engineering Consortium (IEC) has announced the finalists of its 2010 DesignVision Awards program, naming the design tools and products judged as the most unique and beneficial to the semiconductor industry.
The finalists were selected by the DesignCon 2010 Technical Program Committee, consisting of industry experts in the semiconductor and electronic design engineering community. The IEC will announce winners on Tuesday, February 2 at 11:50am in the Main Theater at DesignCon in Santa Clara, CA.
The 2010 award finalists include the following companies and products in each of the eight categories respectively:
Interconnect Technologies and Components
* Samtec for BullsEye
* Molex Incorporated for the EdgeLine CoEdge Connector
* FCI for the High Performance High Density TwinMezz
PCB Design Tools and Technologies
* Altium Limited for the Altium Designer
* Rogers Corporation for the RO4000 LoPro Series Laminate
* Simberian Inc. for the Simbeor 2008.01
Design Verification Tools
* Agilent Technologies for the ADS DDR3 Compliance Design Kit
* DFT Microsystems for the DV1600 SerDes Validation Tester
* Synopsys for the VCS 2009.09
System Modeling and Simulation Tools
* Sigrity for the Channel Designer
* Mentor Graphics for the HyperLynx PI
* E-System Design for SPHINX
Test and Measurement Equipment
* Agilent Technologies for the Agilent J-BERT N4903B
* SyntheSys Research for the BERTScope Si 25000C & BERTScope CR 25000A
* LeCroy Corporation for the WaveMaster 830Zi
IC Design Tools
* Cadence Design Systems for the Encounter Digital Implementation System
* Altera Corporation for the Quartus II Software version 9.1
* Xilinx for the Xilinx ISE Design Suite 11
Semiconductor Components and ICs
* PMC-Sierra for the HyPHY 10G & 20G
* Maxim Integrated Products for the MAX2078
* SiBEAM for SiBEAM’s Second-Generation SB9220/SB9
Semiconductor IP
* Cadence Design Systems for the Chipestimate.com Semiconductor IP Customer Testimonials
* Coreworks for the CWda60 – Sideworks Dolby Digital Professional Encoder IP
* Rambus for the Rambus and Kingston Threaded Module
"We are very proud to honor the work of individuals and companies who have shown outstanding commitment to advancing the electronic design and semiconductor industry with the DesignVision Awards,” stated IEC President John R. Janowiak. “We also thank the members of the Technical Program Committee for judging the exceptional submissions received this year.”
The DesignVision Awards are judged according to criteria of: innovation; uniqueness; market impact; customer benefits; and value to the industry. Visit www.designcon.com/2010 for full information.
