DKN Research (Haverhill, MA) has developed a new method for using an ultra-thin PCB connector on high-density flexible substrates.
According to reporting at Circuits Assembly.com, DKN is partnering with with Hirai Seimitsu Kogyo Corp. and NY Industries Ltd. on research and development for its UTF connector series. A functional range has been developed, for parameters including SMT soldering type, adhesive fixed type, hinge opening type, and a no soldering type. The concept model reportedly can be applied to all mounting methods.
According to the report, the UTF connector's design will incorporate arrayed micro bumps inside a thin cover substrate hinged to the frame, permitting it to precisely align with the flexible substrate and securely connect with a PCB or electronic component. A hook-type mechanism was added to a thin metal plate cover to provide uniform pressure on the back of the bump array; the connector can be mechanically locked onto the guide holes of a rigid PCB.
When a high-density flexible substrate is connected to a rigid PCB using the UTF connector series, the mounted height from the PCB surface is less than 0.3 mm. Micro bumps are arrayed on UTF connectors, making larger bump pitches compared to the circuit density on the flexible substrate.
SOURCE: Circuits Assembly
