Harwin Inc. (Salem, NH) has introduced its EZ BoardWare brand, comprising surface mount products designed to improve manufacturing flexibility, reduce manufacturing costs and improve in-field maintenance.
With EMC technology, contends Harwin, shielding cans are usually soldered to the board as a secondary operation after the main automated assembly process. However, the company's EZ-Shield Clips can be surface mounted, allowing a shielding can to simply be pushed into place during final assembly.
Also part of the EZ BoardWare range, the EZ-RFI Fingers are versatile parts that allow for a sliding or wiping contact to facilitate electrical contact between the PCB and metal cases, etc., for reduced manufacturing costs when compared to the use of grounding finger strips.
For cable management, the EZ-Cable Clips are smaller and lower profile than equivalent plastic devices. The clips are placed directly onto solder pads, negating the need to drill retaining holes in the PCB, offering further space and cost savings.
The EZ-Jumper Links enable designers to eliminate through-hole vias and multi-layer construction. Surface mount assembly reduces costs, and quality is improved through using proven, controlled manufacturing processing, according to Harwin.
Lastly, the EZ-Test Points provide technicians with easy-to-see test points and minimize the risk of PCB damage by incorrect test ing methods.
“Often, relatively simple issues can frustrate good board design and cause manufacturing delays and costs," comments Harwin product manager, Dave Humphreys. "Traditional methods used to solve cable management, test and EMC problems often require secondary, manual processing. The EZ BoardWare components can all be surface mounted along with other components, saving space as well as reducing time and costs."
For more information, visit www.harwin.com.
Contact: Dwayne Beck – Product Manager, Harwin Inc.
Tel 812-542-2540
dwayneb@harwin.com
Doug Steele – Global VP, Catalog Distribution.
Tel 812-542-2542
dougs@harwin.com
