Molex ClipLok interconnect clip locks down low profile circuit-to-board connections - Connector Specifier

Molex ClipLok interconnect clip locks down low profile circuit-to-board connections


Jun 21, 2011

Molex has released its ClipLok interconnect clip, an electromechanical connection that easily attaches to secure a membrane switch or FPC tail firmly to a printed circuit board, eliminating the need for mating connectors at each point. A first-to-market product, the low-profile ClipLok interconnect clip provides immediate and reliable circuit-to-board connectivity in a range of consumer, medical, networking and telecommunications applications, according to the company.

The latest addition to the Molex line of integrated switch assemblies, the company says the ClipLok interconnect clip offers a less bulky alternative to other circuit-to-board interconnect methods. The mechanical component securely bonds circuits together by means of a spring-type mechanism. Electrical connections are achieved when the switch circuits are wrapped around the edge of the board. Finally, a built-in feature on each ClipLok interconnect clip guides the assembler in the correct placement of the clip and circuit.

“Custom product designs including membrane switches, capacitive switches, touchscreens, display flex assemblies and flex circuit jumpers may all benefit from the ClipLok interconnect technology. The low-profile ClipLok connector design delivers robust features: strong mechanical attachment, excellent electrical integrity, far lower product cost and ease of assembly,” comments Todd Hester, vice president and general manager of printed circuit products, Molex.

Molex’s ClipLok interconnect clip and membrane switch assemblies are qualified through tests based on ASTM (American Society of Testing and Material) standards.

More Info:  www.molex.com


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