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Master Bond EP21FL is a two part epoxy resin system that features low to moderate viscosity, suited for potting, coating and sealing electronic assemblies. The substance excels at bonding dissimilar substrates with different coefficients of expansion. This high performance adhesive has a wide service temperature range of -60ºF to +250ºF.
The system produces high strength castings, bonds and seals which are remarkably resistant to thermal cycling and shock. bond strength is generally greater than 1,500 psi and its tensile strength normally exceeds 1,100 psi. Typical viscosity of Part A is 4,000 cps at 25ºC and 10,000 cps at 25ºC for Part B.
The hardened compound is an electrical insulator with a volume resistivity greater than 1012 ohm-cm. As a flexibilized system, it is characterized by superior impact and chemical resistance.
EP21FL is available in half pint, pint, quart, one gallon and five gallon container kits.
CONTACT:
James Brenner, Marketing Manager
Email: jbrenner@masterbond.com
Tel: 201-343-8983
Fax: 201-343-2132
MASTER BOND INC.
154 Hobart Street
Hackensack, NJ 07601-3922
Web: www.masterbond.com
