New SATA spec eliminates module connector for embedded SSDs - Connector Specifier

New SATA spec eliminates module connector for embedded SSDs


Aug 9, 2011

The Serial ATA International Organization (SATA-IO) has announced a new standard for embedded solid state drives (SSDs). The SATA µSSD specification eliminates the module connector from the traditional SATA Interface, enabling developers to produce a single-chip SATA implementation for embedded storage applications.

According to the consortium, the µSSD standard offers a high-performance, low-cost, embedded storage solution for mobile computing platforms like ultra-thin laptops. The specification defines a new electrical pin-out that allows SATA to be delivered using a single ball grid array (BGA) package. The BGA package sits directly on the motherboard, supporting the SATA interface without a connecting module. By eliminating the connector, the µSSD standard enables the physically smallest SATA implementation to date, making it an ideal solution for embedding storage in small form factor devices.

“As tablets and other small computing devices continue to proliferate in the market, the need for scalable small form factor storage solutions rises exponentially,” said Mladen Luksic, SATA-IO president. “µSSD provides a new way to leverage the speed, reliability, and low power requirements of SATA technology in these types of products to enable powerful new computing platforms.”

SATA-IO is also developing interoperability tests for µSSD products that will help ensure devices based on the µSSD standard will be compatible with other µSSD-based products. Products based on the µSSD specification are already available from SanDisk Corporation. Samsung and Toshiba have also expressed support for the standard.

SanDisk currently utilizes the new specification in its iSSD integrated storage device, billed as the world's smallest, fastest 128GB (SATA 6 G/bs) SSD. “The SATA µSSD standard is a significant industry achievement that brings high-performance SSD storage in a BGA form factor,” said Kevin Conley, senior vice president, client storage solutions, SanDisk. “This is enabling OEM designs of new super-thin Ultrabooks and tablets with high SATA performance.”

"The µSSD specification will enable embedded storage applications to give designers greater design flexibility,” said Scott Nelson, VP Memory Toshiba America Electronic Components, Inc. “Toshiba is pleased to support the development of this specification, which will help enable the continued evolution of thinner and smaller personal computing devices.”

More Info: www.sata-io.org


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