SATA-IO to develop mini interface connector spec - Connector Specifier

SATA-IO to develop mini interface connector spec


Sep 29, 2009

September 29, 2009 -- At the recent Intel Developer Forum 2009 in San Francisco, the Serial ATA International Organization (SATA-IO), the consortium dedicated to the dissemination of serial ATA (SATA) technology, announced that it is developing a specification for a mini-SATA (mSATA) interface connector. The new low-profile connector will enable more effective SATA integration in small form factor applications, says the consortium.

According to SATA-IO , the mSATA technology leverages the speed and reliability of the SATA interface to provide a high-performance, cost-effective storage solution for smaller devices like notebooks and netbooks. The specification maps SATA signals onto an existing small form factor connector, enabling more compact integration in a wide variety of applications for both hard disk (HDD) and solid state drives (SSDs). The mSATA connector allows companies to increase the storage offerings of their products without compromising valuable space, maintains the consortium.

mSATA is particularly beneficial for manufacturers planning to incorporate small form factor SSDs (approximately the size of a business card) in portable PC devices, where space utilization and cost minimization are key concerns.

"As consumers become more reliant on mobile devices, it makes sense to bring the efficiency and speed of SATA technology to this burgeoning highly portable product segment," comments Knut Grimsrud, SATA-IO president and Intel fellow and director of storage architecture. "Solid-state drives provide a rugged, lightweight and lower power storage solution for these devices, and mSATA is one of the few interfaces that can provide a critical compact connection for these small-form factor SSDs."

mSATA will support 1.5 Gb/s and 3.0 Gb/s transfer rates.

"SATA is already the predominant storage interface used in the hard disk drive (HDD) market," says Jeff Janukowicz, research manager for Solid State Drives at technology consulting firm IDC. "The mSATA specification extends the low-cost, high-speed benefits to the rapidly growing SSD market, increasing the options for manufacturers to develop small form factor solutions."

Development of the mSATA specification is being driven by members of the SATA-IO Cable and Connector Working Group, including Dell, HP, Lenovo, Samsung, SanDisk, STEC and Toshiba.

"SSD technology can work inside of virtually any form factor, so the new SATA specification should go a long way in encouraging extremely compact SSD storage designs," comments Jim Elliott, vice president, memory marketing, Samsung Semiconductor, Inc. "Highly compact Samsung SSDs are perfectly suited as a cost-efficient storage medium for the growing slim notebook marketplace, particularly netbooks."

"One of the key values SSDs enable is smaller form factors that allow both notebook and netbook computers to be lighter, thinner and more stylish," adds Don Barnetson, sr. director of marketing for SanDisk. "SanDisk is pleased to support the mSATA form factor as part of our leading pSSD product line which will be on display at the SATA-IO booth at the upcoming IDF."

"Initial adoption of most SATA solid state drives has followed the HDD form factor. Using new mSATA modules enable a smaller, internal module connected to the system board for notebooks, mobile and other embedded storage applications to enable designers greater design flexibility," concludes Scott Nelson, VP memory, Toshiba America Electronic Components, Inc. "Toshiba is introducing mSATA modules using 32nm NAND in 30 and 62GB densities with read speeds of 180MB/s and write speeds of 50MB/s."

On the Web:
www.sata-io.org
www.intel.com/IDF


Editor's Picks

Incapable connectors shut down Large Hadron Collider

Amphenol: Bulking up via buyout

NASA unveils deep space MPCV exploration craft; Lockheed Martin responds

As UAV market surges, connectors adapt

NHTSA pressures Ford into mass F-150 truck recall on airbag wiring danger

Esterline acquiring Souriau for $715 million

Report: Single trader holds half of world's copper


Top Blog Posts

Inside Foxconn's deadly iPad factory after the blast

Fireproof electronic connectors: design challenges

Connector industry giants saw banner 2010 sales growth

Tearing down Apple's Thunderbolt cable

Massive solar tower will rank among world's tallest buildings


Most Popular Articles
Top Articles for 2011

Boeing exec admits 787 outsourcing strategy backfired

Foxconn staggering after full year net loss of $200M+

The Motley Fool' pits Amphenol vs. Molex

ITT issues military-aerospace connector sourcebook

SATA-IO unveils portable consumer storage specification

Raytheon locks in LaBarge for cruise missiles' wiring harnesses post-Libya bombing

Union group denies Verizon fiber lines vandalized

Northrop Grumman seeks to replace copper-based aircraft wire, cabling

Driving wiring harness design data toward manufacturing


Latest Community Discussions

Video: Fire breaks out at Foxconn's Shandong plant
Bystander video shows the scene of a fire breaking out on September 27 at Foxconn's Yantai Shandong plant where Sony consumer electronics products are reportedly assembled.

Testing the Boeing 787 Dreamliner's in-flight entertainment systems
Boeing video shows what was involved in testing (i.e. "trying to break") the in-flight entertainment, connectivity, and power systems on board the new 787 Dreamliner.

Belden FiberExpress Brilliance LC Connector Installation
Video details installation of a 900-micron OM3/OM4 prepped fiber into an LC connector.

Visit the Community >


Receive Free E-mail Newsletters from Interconnection World


You may select more than one newsletter  
Interconnection World
Connector Specifier
Wire & Harness Specifier

 
Name  
 
Email  
 
Country  
 
 
 

 
Sponsor Information

Interconnection World Content Categories:

Wire & Harness
 Data & Telecom
Standards Distributors
Design & Test Applications
Business Wire News
Video