ITT Interconnect Solutions (www.ittcannon.com) says it is now qualified to manufacture MIL-DTL-38999 class G connectors, as well as class F (electroless nickel), W, and B (cadmium) options. While ITT has developed space-grade connectors for many years, the company is now designing products to meet the Thermal Vacuum Outgassing specification of MIL-DTL-38999.
The MIL-DTL-38999 Thermal Vacuum Outgassing requirements stipulate that “all non-metallic materials shall not release greater han 1.0% total mass loss (TML) and 0.1% collected condensable material (CVCM).”
“By utilizing a special potting and lubricant material, we succeeded in meeting these demanding TML and CVCM parameters, and outgassing of the connectors is achieved by baking at 350° C for 48 hours,” says Keith Teichmann, director of marketing for ITT Interconnect Solutions. “The connectors are offered in all standard product line and series I, II and II shell styles.”
ITT says its MIL-DTL-38999 class G connectors are designed with aluminum shells and standard M39029 copper alloy contacts, and are available in a variety of layouts as described in MIL-STD-1560. Operating temperature ranges from -65° C to +200° C.
The company adds that its space-grade connectors are built to withstand 500 mating cycles.
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