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July 6, 2009--E-tec Interconnect's FastLock socket retention system is designed for BGA, LGA, QFN, and Gullwing chip sockets, and is available in SMT/Thru-hole (pictured) and solderless versions.
The locking system features press-down forces that can be pre-set and re-adjusted manually, open top for access to chip die and for improved heat dissipation, minimum 10,000 cycles, and an easy open/close method requiring no screws or tools. Applications include high-density PCBs.
On the Web: www.e-tec.com
