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June 19, 2009--US Conec Ltd.'s reduced footprint MTP brand adapters have the same panel cutout dimensions as that of SC and duplex LC connectors, and the condensed cross-sectional area is designed to simplify the transition from simplex or duplex connectivity to higher density connectivity.
Panel cutouts are per TIA/EIA 604-10A. The adapters can support up to 72 fibers per TIA 604-5D, and are supplied with a dust plug produced from a proprietary thermoplastic resin. This advanced engineering material is V0-rated, RoHS- and REACH-compliant, static-dissipative, and has a TML outgassing spec of <1% per ASTM E595.
On the Web: www.usconec.com
