Master Bond debuts nanosilica-filled epoxy - Connector Specifier

Master Bond debuts nanosilica-filled epoxy


Jun 16, 2009
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June 16, 2009--Master Bond Inc.'s UV22 is a nanosilica reinforced, UV curable epoxy system. The nano-sized filler (<50 nm) is designed to give the cured system exceptional abrasion resistance, optical clarity, physical strength properties, and low shrinkage, plus low viscosity of 4,000 cps. The tensile strength of the cured epoxy is greater than 4,600 psi and its tensile modulus is greater than 500,000 psi.

UV22 is designed to cure rapidly upon exposure to UV light at room temperatures. As a single component system, it requires no mixing. Post curing UV22 enhances its temperature and chemical resistance properties. For example, says Master Bond, post curing at 90-125° C for 30 minutes will give UV22 a glass transition temperature of greater than 120° C--far higher than traditional UV cure systems. It has a service temperature range of -60 to +300°F.

Applied with syringe applicators, UV22 is solvent-free and not oxygen inhibited. It is also available in a specially formulated, dual-cure version called UV22DC, which can be cured by UV light or by the application of heat, making it especially suited for applications featuring "shadowed out" areas not reachable by UV light.

On the Web: www.masterbond.com



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