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June 1, 2009--Henkel's Multicore LF700 lead-free, halide-free solder paste is designed to reduce voiding in BGA solder joints. The company says the materials provides stability during high-speed component placement and offers long printer abandon times of up to four hours "even when printed onto extremely fine-pitch 0.4mm CSP apertures."
Multicore LF700 is designed for excellent solderability over a range of reflow profiles in both air and nitrogen, and on surface finishes that include Ni/Au, Immersion Sn, Immersion Ag and OSP copper. Low viscosity allows for "outstanding deposition and reliable print performance on today's small- and medium-sized PCBs without sacrificing anything in the way of reliability or process capability."
On the Web: www.henkel.com/electronics
