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May 28, 2009--FCI's HCI high-power backplane and midplane connector series is designed to address additional power requirements at the interface between daughter cards and backplanes or midplanes in chassis-based platforms. These compact 2- and 3-position power modules utilize recently introduced HCI technology to enable increased linear power density along the daughter card edge.
The backplane and midplane connectors are intended for host-to-card applications, such as the blade, controller card or line card interfaces in servers, storage enclosures, networking or communications equipment.
HCI High Power modules are rated for up to 75A per contact without exceeding a 30° C temperature rise (no airflow). Individual power contacts are surrounded on four sides by molded housing walls so that adjacent power contacts cannot short together. In addition to conventional 1 x 2 and 1 x 3 power contact configurations, a 2-position module is available with an integrated guide between the two power contacts.
The series offers up to 261A/inch linear power density and is based on standard stamped-and-formed power contact technology.
Typical pricing for the 2-position HCI High Power configuration is $6.50 per mated pair in prototype quantities.
On the Web: www.fci.com/hcihighpower
