May 26, 2009--Henkel's Hysol UF3800 underfill has been designed for use with CSP and BGA devices, particularly handheld communication and entertainment applications. The company claims Hysol UF3800 "flows fast at room temperature and cures quickly at low temperature." In addition, the material is reworkable, which can improve final yield while reducing scrap.
Hysol UF3800's halogen-free material meets the current accepted industry standard of less than 900 parts per million (ppm) chlorine (Cl) and bromine (Br). It is compatible with a variety of lead-free and halogen-free solder pastes, and the proprietary chemistry of the material offers a relatively high glass transition temperature (Tg) required for improved thermal cycle performance as well as good
reworkability. In most cases, reworkable materials have a low Tg, which then also lowers the thermal performance. But according to Henkel, Hysol UF3800 offers both a high Tg and reworkability.
This underfill also offers stable electrical performance under temperature humidity bias (THB), an essential performance metric as devices continue to get smaller and I/O pitches become tighter. Hysol UF3800, the company claims, is "the only known commercial material to provide fast flow at room temperature, low temperature fast curing, high Tg, reworkability, excellent thermal performance and stable electrical performance under THB--all in a single formulation."
On the Web: www.henkel.com/electronics
