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January 13, 2009--Molex's EdgeLine family of one-piece connectors are designed to support high-speed signal transmissions using an card edge interface and a vertical or right-angle insertion. These connectors are a flexible and scalable solution for a wide variety of low-to mid-range telecom, computing, and storage applications.
"As systems become more complex, greater levels of interconnectivity require boards with more layers. This leads to thicker boards, and the EdgeLine Edge Card connectors address this need by offering two versions," says Kevin O'Connor, global product development manger. "Both the EdgeLine Coplanar and Edge Card connector were also formatted to meet Telcordia requirements to ensure interoperability for telecom industry standards."
EdgeLine Edge Card connectors for vertical insertions feature high-speed differential performance up to 12.5 Gbps; offer a 0.80-mm (.031") terminal pitch; accommodate two board thicknesses, 1.57 and 2.36mm (.062 and .093), with a future capability to mate to a 2.00 mm (.079") to support multiple PCB layers on complex product designs; are available in various circuit sizes (30 to 294), with or without a center key; meet MicroTCA requirements.
EdgeLine CoPlanar connectors for right-angle insertions accept a 1.57-mm (.062") thick PCB; have a terminal pitch of 0.75 mm (.030") to accept AdvancedTCA 170-circuit standard cards; offer enhanced airflow and thermal management with low profile of 6.00 mm (.236") above main board; and are available in various circuit sizes (68, 140, 170, 226 and 250), with an optional center key.
The two press-fit connectors offer a common or singulated ground to manage power and slow-speed single-ended signals in addition to high-speed differential circuits. Various standard circuit sizes are available as well as customized pin-out solutions.
On the Web: www.molex.com
