September 11, 2008 -- Omron Corp. is to release its XF3C, a low-profile FPC [flexible printed circuit] connector with a pitch of 0.25 mm. According to the company, the connector represents a 20% reduction in footprint compared to its previous FPC connectors.
FPCs are used in a wide range of applications, including mobile devices. The company maintains that recently, there has been an increase in the use of FPC connectors with impact-resistant backlock mechanisms for mobile devices such as cellular phones, MP3 players, and notebook PCs. In addition, demand is strong for smaller FPC connectors to meet the need to reduce mounting space inside devices accompanying the trend toward smaller and thinner devices, says Omron.
In response, the company says it developed the XF3C connector, which has a pitch of 0.25 mm, a depth of 3.8 mm (when locked), and a footprint approximately 20% smaller than that of previous OMRON connectors, which had a 0.3 mm pitch. Within its 0.85 mm height, the connector contains the contact structure for both the upper and lower contacts, eliminating the need to differentiate between them and in turn contributing to the standardization of connectors.
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