June 4, 2008 -- Reflex Photonics, a developer of extreme high-speed optical connectivity platforms for semiconductor packaging and data transfer applications, has released its Light on Board HyperDense product line. The company says the parallel channel optical components are 1000-Gbit/sec- capable, targeting intra- and inter- PCB applications with support for all physical layer protocols.
HyperDense is the first product in the company's Light on Board family of optically enabled semiconductor packaging solutions for ultra short reach (USR) interconnections to and between IC packages on a single PCB. Each HyperDense component features 12 individual parallel fiber-optic channels integrated into MT-based I/O connector modules, with each channel capable of speeds of up to 10 Gbit/sec. The HyperDense products can be configured as transmitters, receivers or transceivers, with up to eight I/O connector modules available to be ordered for each type of product.
"The Light On Board HyperDense IC package demonstrates the natural evolution of optical interconnections towards the microchip," comments David Rolston, CTO of Reflex Photonics. "The technology adds tremendous I/O bandwidth to the microchip package without disturbing the current design and manufacturing methods of chips, IC packages or printed circuit boards."
According to Reflex Photonics, at a full configuration, the HyperDense transmitters and receivers each will be able to handle an aggregate of up to 1000 Gigabits (1 Terabit) per second with the 96 channels each running at 10 Gbit/sec. The transceivers can handle simultaneous bi-directional data in the aggregate of up to 480 Gbit/sec, with each of the 48 receive and 48 transit channels running at 10 Gbit/sec.
The Light On Board technology is designed to augment industry standard IC packages with the addition of optical interconnects without changing the chip, the IC package, or the PCB manufacturing methodology. The company notes that the technology respects all aspects of IC packaging and board assembly such as package size, footprint, solder-re-flow, and chip interconnections, so as not to disrupt the processes developed by IC and PCB manufacturers. All existing electrical high-speed connections to the ASIC are maintained, in addition to the optical connections added with Light on Board, and all optically-enabled chip packages are connected via industry standard multi-fiber ribbon cables and patent pending Light on Board mating clips.
Reflex maintains that its Light on Board enabling technology provides a platform for connections to ASICs by introducing pre-aligned optical-to-electrical (or electrical-to-optical) channel connector modules into standard IC packages. Integrated within the channel connector modules are proprietary pre-aligned optical engines, called LightABLE Optical Sub-Assemblies (OSA). These compact, encapsulated, thin modules can be pick-and-placed into the IC package alongside the chip. The distance between the ASIC and the LightABLE OSA is significantly less than one inch, in order to immediately convert the ultra-high speed electrical signals into optical signals. Because Light on Board focuses on USR interconnects to and between ICs on a single printed circuit board, it effectively enables "chip package-to-chip package" and "fiber-to-the-chip package" solutions, according to the company.
"Reflex Photonics' technology enables next generation computing and switching applications and presents a compelling choice for both commercial and consumer electronics' implementations for multiple high-speed inputs and outputs. Light On Board, while providing developers with opportunities for very significant savings relative to size, power, board space and signal fidelity performance improvements, is a broad platform merging the data communications abilities of optics with the computing wizardries of silicon in a cost effective manner like never before," remarks Gary Moskovitz, president and CEO of Reflex Photonics. "We look forward to introducing additional product lines, and strategic partner application-specific solutions, to our Light on Board family later this year."
