Precision over-molding, 3-D services introduced
Miniature high-rel connector manufacturer Omnetics (www.omnetics.com) now offers a precision over-molding service, enabling defense, medical, and other high-reliability applications to have electrical connectors molded into equipment housings. The process ensures that contamination is minimized, and enables simplified sterilization. Connector insulators are first assembled with pins or sockets that have been pre-wired or have solder lugs on the back. Customers’ mechanical assembly drawings or solid models are used to size and specify the internal dimensions of the housings, handles, and probes that will contain the connectors. Injection over-molding processes complete the final step of fabrication, forming the final assembly. Omnetics is also offering downloadable 3-D solid models for its entire range of COTS and standard connector products. The files can be imported into a variety of CAD programs for the design of interconnects within a particular application.
Ultra miniature RD strip connectors target PCB connectivity
Electrical connector developer Hypertac (www.hypertac.com) has unveiled an ultra miniature high-density RD strip connector designed for PCB applications in harsh environments, including aerospace and military. Designed in SMT and THT terminations, the connectors use a 0.30-mm hyperboloid contact and are offered in one or two rows with a pitch of 1.27 mm. Hypertac says its technology is especially suitable for PCB and MCM stacking, and flex or wire-direct connections. Enabling a low stacking height with mated connectors at 6.9 mm, the connectors are designed for low contact resistance, a 3-amp current rating for each pin contact, and immunity to shock and vibration.
Developers pushing for 10x USB throughput
Intel (www.intel.com) is being joined by Hewlett-Packard, Microsoft, NEC, NXP and Texas Instruments in developing the USB 3.0 specification that could deliver 300 Mbytes/sec of usable data and add quality-of-service enhancements designed to challenge the Firewire 1394 interconnect. Intel engineers have reportedly tested a basic version of the new protocol with its SuperSpeed USB interconnect in software simulations at 5 and 25 Gbits/sec. According to Intel, the interconnect will run over copper and fiber and is being designed to serve any flash-based device. USB 3.0 could produce a throughput of 10x its current rate. The partnering companies planned to hold a two-day design review in November, and Intel says the group will soon issue a call for contibutors to the final spec. The group hopes to finish the specification in early 2008 and see first silicon produced by early 2009.
World cable assembly market analysis online
Bishop & Associates’ (www.bishopinc.com) World Cable Assembly Market Connectors has been made available online at The Infoshop (www.the-infoshop.com/ee/54302). The report offers in-depth analysis of the evolving cable assembly market, including forecasts for connector shipments by industry sector, cable assembly type, type of cable assembly manufacturer, connector family, and geographic region. The report examines 11 major end-user industry sectors, with types of harnesses and cable assemblies characterized by construction type, connector content, geographic region, and cable assembly channel of manufacture.
Customs detain connectors allegedly destined for Iranian missiles
Singapore Customs recently fined World Freight Pte. Ltd. $14,500 for attempting to export missile parts headed to Iran without receiving permission for shipping certain types of strategic goods under the Strategic Goods Control Act. According to the Customs office, a consignment of “controlled military electronic connectors” meant for missiles was intercepted en route from Switzerland to Iran. Strategic goods include products that have the potential of being used to develop weaponry and for laser, camera, and chemical products for both civilian and military use.
