Momentive Performance Materials (www.momentive.com) has developed a two-component fluorosilicone encapsulant (FRV138) designed to protect sensitive components from both chemical and mechanical stresses. While electronics potting applications are the chief target for FRV138, depending on the design requirements, it may also be of potential use in connector applications.
The encapsulant is a firm gel designed for minimal absorption of fuels, oils, solvents or other chemical vapors and liquids. Applications include the automotive, aerospace, and chemical industries, where components need protection to withstand exposure to extreme heat, cold, or mechanical shock.
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The consistency, and what the company calls “superior dispensing characteristics,” of FRV138 also makes it suitable for the protection of delicate parts in applications where small or deep crevices must be filled.
The encapsulant is heat-curable at 90º C and retains its elastomeric properties from -40º to 150º C. The two components can be easily mixed together and applied manually or via automated dispense equipment.
“By developing a fluorosilicone encapsulant that offers both mechanical and chemical protection, we are enhancing the production of electronics and other sensitive components that can function better and longer in tough operating situations,” says Momentive marketing manager Jim Papa.
