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To meet increasing market demand for hybrid I/O connectors, TE Connectivity (TE) has introduced its 0.6mm CL (centerline) high-speed CHAMP docking series connector. The docking series connector is designed for high-density, low-profile (3.8mm) shield applications featuring two rows of contacts on a 0.6mm pitch centerline. Contacts on a 0.6mm centerline can save 30% linear board space and the 3.8mm low-profile housing reduces connector height by approximately 25%, notes the company.
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TE's 0.6mm CL high-speed CHAMP docking series connector is designed to meet various industry transmission standards including USB 3.0, HDMI 1.4 and DisplayPort 1.2. Multiple options are available including right-angle receptacles, right-angle offset receptacles and vertical plugs for both dock and cable applications. The product can be applied in the PC (laptop and tablet) and mobile device industries.
For more information on TE's 0.6mm CL high-speed CHAMP docking series connector, visit http://www.te.com/products/pcdocking-pr.
