MANUFACTURING EQUIPMENT & TOOLS - Connector Specifier

MANUFACTURING EQUIPMENT & TOOLS


May 1, 2007

PNEUMATIC CRIMPING DIE

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The Air-Matic family of wire crimping applicators features the company’s SmoothFeed pneumatic feed system, designed to provide a more consistent and smoother feed of the terminal. According to the company, mis-feeds are greatly reduced since terminal feeding is done after the crimp cycle when there are no obstructions. It is engineered to process wires from 28 to 10 AWG.
ARTOS ENGINEERING, WAUKESHA, WI
www.artosnet.com

CONNECTOR CLEANING KIT

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Five new fiber-optic cleaning kits for a variety of installation needs include alcohol cleaning wipes, adapter swabs, and reel cleaners. Also available are 200× and 400× microscopes. Kits are packed in one of two available carrying cases.
FIBERDYNE LABS INC., FRANKFORT, NY
www.fiberdyne.com

HAND-HELD FILM THICKNESS TOOL

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Designed for fastener, connector, and general metal-finishing, the System HMX hand-held XRF film thickness measurement tool features a variety of measurement capabilities, including at-process for QC, plating line, and analysis lab application and at-sample analysis in the factory or field. The unit also measures alloy sorting and identification for substrate materials management. A proprietary batch measurement mode lets you calculate the average thickness of a batch of small parts with a single measurement. The system is also an XRF solution for measurement of large samples that commonly cannot be measured in chamber-based systems.
MATRIX METROLOGIES, HOLBROOK, NY
www.matrixmetrologies.com

NO-CLEAN, LEAD-FREE SOLDER PASTE

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Multicore LF600 is a halide- and lead-free, no-clean solder paste formulated for humidity resistance. Especially suited for multi-national manufacturing, the paste promotes superior printing and reflow performance in environments with temperatures of up to 86° F and 80% relative humidity. The fomulation uses a new activator chemistry that combines coalescence with ultra-low voiding. The material also features a proprietary gelling technology that enables zero hot slump, eliminating issues with mid-chip solder beading.
HENKEL CORP., IRVINE, CA
www.henkel.com/electronics


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