ERNI makes a new name for itself
As of January 1, connector manufacturer ERNI (www.erni.com) is now known as ERNI Electronics, a move seen as affirming the company’s global presence and product portfolio for the international market. Focusing initially on development and manufacturing of relays, the company entered the interconnect market in 1967 with the development of the first backplane connector. “From its beginning as a provider of relays and electric controls, ERNI Electronics has advanced to become a supplier of diverse connectors, backplanes, and complete electromechanical rack systems,” says Martin Seidenfuss, managing director of ERNI Electronics. “By changing the company name, we are keeping step with ERNI’s evolution as a business.”
10GBase-T system completes 100-meter compliance
SYSTIMAX Solutions from CommScope (www.systimax.com), in collaboration with Ethernet technology developer Solarflare Communications (www.solarflare.com), says that the SYSTIMAX GigaSPEED X10D solution performed to specifications in recent certification test demonstrations of 10GBase-T technology on 100-meter links at Solarflare’s labs in Irvine, CA. The tests were conducted with Solarflare’s 10GBase-T physical layer evaluation boards and a 100-meter GigaSPEED X10D UTP channel in a worst-case, full-reach, four-connector channel configuration. A “six-around-one” configuration was utilized, with six disturbing cables tightly bundled around one “victim” cable. The 10GBase-T signals were launched through a generator at the standard XAUI interface to the PHY evaluation boards. Signals from the receive packets at the far end transceiver were compared to those from the send frames. 10-Gbits/sec Ethernet traffic was carried simultaneously on all six disturbing channels, simulating a worst-case environment for alien crosstalk. SYSTIMAX believes it was the first vendor to provide a full 100-meter UTP solution that guarantees compliance with IEEE 802.3an and Category 6A/Class EA cabling standards.
Non-conductive adhesive technology targets image sensors
Henkel Corp. (www.henkel.com) has developed a non-conductive paste (NCP) underfill encapsulant designed to address the image sensor market. The new material is specifically formulated for flip-chip image sensor modules, and is designed to provide excellent adhesion to both two- and three-layer flexible printed circuits by bonding to both polyimide and epoxy adhesive material. The Hysol FP5110 technology is an alternative to traditional mechanical soldering, bonding bumps to the substrate through a lead-free compatible thermal compression process that the company says simplifies flip-chip assembly and eliminates the need for flux application, reflow, and cleaning.
Interconnect Web site to embrace multiple languages
With an eye toward a greater global presence, power interconnect developer Anderson Power Products (www.andersonpower.com) says it plans to enhance its Web site this year by adding multiple versions translated in several languages. The multi-language feature is one of several upgrades the company plans to make to its site. In addition, the company says users will find enhanced access to detailed information about the company’s products, including the ability to search for RoHS-compliant products, download product information and specifications, access technical information, view temperature charts, modify and view line drawings, review tooling information, and reference assembly instructions.
