January 18, 2007 -- Leveraging a contact system licensed from Ardent Concepts (www.ardentconcepts.com), Hypertronics (www.hypertronics.com) has introduced its HyperGrid technology, a micro-miniature connector platform optimized for high reliability military/aerospace applications.
According to the companies, the HyperGrid technology employs Ardent Concepts' RC Springprobe contact technology, resulting in interconnect solutions that offer the same tiny form factor, high node count and stackability features required in many micro-miniature applications, but without the electrical, repeatability or cost limitations associated with other technologies such as pogo pins, fuzz buttons, and conductive elastomers.
According to Ardent Concepts, proven in rugged test bed applications, the RC Springprobe contact technology incorporates solderless compression style connections requiring only 20 grams of force per node to maintain connectivity, with a contact pitch as low as 0.4 mm, ideal for high density designs. Other key features of the technology include excellent AC performance, with multi-GHz bandwidth, exceptional signal integrity and consistent DC resistance; and superior durability, that exceeds 100K compression cycles, with excellent shock and vibration performance.
"Ardent's patented contact technology provides superior performance, size and cost advantages that are production-proven in other high-reliability applications," comments Gordon Vinther, president of Ardent Concepts. "Hypertronics' expertise in meeting mil/aero requirements makes them an ideal partner for driving our contact technology into this market."
The scalable HyperGrid technology will be available as custom interconnects for PCB-to-PCB, flex cable-to-PCB, and IC-to-PCB designs. The license agreement with Ardent Concepts is exclusive for military/aerospace applications, allowing Hypertronics to provide specialized mil/aero customers with a unique interconnect solution not available with any other vendor.
"Hypertronics is always looking to acquire technologies that are complimentary to our high-reliability Hypertac hyperboloid contact design," remarks Garry MacDonald, Hypertronics vice president of engineering and business development. "This license agreement with Ardent Concepts enables Hypertronics to expand its custom interconnect solutions to new applications requiring micro-miniature form factors."
