UV CURE ADHESIVE
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ABLEUX AA50T adhesive and ABLEBOND BF-4 backfill materials are designed for the active alignment and assembly of transceiver packages, withstanding changes in temperature and humidity. The adhesive is a UV/visible light cure material designed to combine quick fixturing and low shrinkage with low outgassing. The thermal-cure epoxy backfill material is designed to provide additional structural strength and protection for aligned components. This single-pack, pre-mixed, frozen epoxy eliminates mess, mix unreliability, and waste issues associated with typical two-part epoxy backfills.
ABLESTIK, RANCHO DOMINGUEZ, CA
www.ablestik.com
AUTOMATED TAPE DISPENSER
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For simplified labeling tasks, the carousel-style EZ-8000 automatic tape dispenser cuts tape at the touch of a button, placing cut pieces on its turntable for easy removal by either single or multiple users. According to the company, nearly any 3 to 25-mm tape or film with adhesive backing can be used with the dispenser. It will cut tape into lengths ranging from 9 to 61 mm.
ASG/ JERGENS, CLEVELAND, OH
www.asg-jergens.com
LEAD-FREE SOLDER PASTE
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ALPHA OM-350 lead-free solder paste is designed to deliver high first-pass yield and low rework rates required for notebook, laptop, and desktop motherboards, as well as other similar complex surface-mount applications. According to the company, ALPHA OM-350 addresses issues such as mid-chip solder balls, print volume repeatability, tombstoning, and electrical reliability. For large BGA component assembly requiring a long, hot soak reflow profile with a lead-free alloy, ALPHA OM-350 can increase first-pass yields, reducing defects.
COOKSON ELECTRONICS, JERSEY CITY, NJ
www.cooksonelectronics.com
ADHESIVE, UNDERFILL EPOXY
GPC-251A/B, a thermally conductive adhesive, and underfill epoxy 123-38a/B187 are designed for flip-chip assembly, which replaces wire bondings as the electrical connection of components onto substrates or circuit boards. These materials are designed for such applications as connectivity in automotive electronics, cell phones, and hand-held electronic devices. The adhesive is a silver-filled, electrically conductive, two-part room temperature curing material. According to the company, products cure in 24 hours at 25° C, 60 minutes at 65° C, and 5 minutes at 120° C. The underfill epoxy is designed to strengthen the assembly, protecting it from moisture, and releasing entrapped air during the cure process.
CREATIVE MATERIALS, TYNGSBORO, MA
www.creativematerials.com
CASTABLE URETHANE
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Liquid Flexane compounds are designed for a variety of OEM applications, including patching of cable jackets after splicing. These castable, non-shrinking, waterproof urethanes are suitable for indoor or outdoor applications, and withstand temperatures ranging to 350° F. Liquid Flexane produces no VOC emissions, cures at room temperature, and is available in several viscosities. The material features a cured hardness range from Shore A 78 to Shore A 97, tensile strengths up to 3,300 psi, tear resistances to 515 pli, and dielectric strengths to 350 volts/mil. Flexanes for strain relief and potting, encapsulating, and insulating electrical connectors, wires, and cables include Flexane 80 Liquid-a medium-viscosity formula that cures to semi-rigid rubber.
DEVCON, DANVERS, MA
www.devcon.com
LEAD-FREE SOLDER PASTE
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LF Green, a patent-pending lead-free solder paste, helps eliminate the liablility of cross-contamination and operator confusion between leaded and lead-free paste in a mixed production environment. The paste’s green appearance provides users with easy-to-identify lead-free solder on stencils and printed circuit boards until reflowed. LF Green’s post-reflow residues are UV-detectable to help you further distinguish lead-free from leaded solder on assembled components.
QUALITEK INTERNATIONAL, ADDISON, IL
www.qualitek.com
THERMALLY CONDUCTIVE ADHESIVE
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Enhanced Loctite Bead-on-Bead technology is a two-part, no-mix, no-measure thermally conductive adhesive designed to replace traditional, solvent-activated systems. According to the company, the adhesive delivers a 40% improvement in cooling performance over previous products, and is now easier to use.
HENKEL, IRVINE, CA
www.electronics.henkel.com
A TWO-COMPONENT ADHESIVE
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SnapSil RTV23A/B is a two-component, room temperature-cure silicone adhesive that features a tack-free time of approximately six minutes, and primerless adhesion to many substrates. The adhesive is specially suited for industrial assembly applications where a fast cure is desired, where heat-to-cure can damage components, or where double-sided tape, mechanical fasteners, or clamps are used. SnapSil RTV23A/B is available in a single cartridge that keeps the components separate until dispensed.
GE ADVANCED MATERIALS, WILTON, CT
www.ge.com/advancedmaterials
RAPID CURE EPOXY SYSTEM
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EP30HT is a medium viscosity, two-component epoxy adhesive/sealant, coating and casting compound, formulated to cure at room temperature or more rapidly at elevated temperatures. Featuring temperature resistance to 400° F, the epoxy contains no solvents or volatiles. Its dielectric strength is 440 volts/mil, and its volume resistivity is >1015-Ω cm.
MASTER BOND, HACKENSACK, NJ
www.masterbond.com
