 Daniel Mullin |
Siemon Labs’ (www.siemon.com) research and development director, Daniel Mullin, has been awarded the “1906 Award” by the International Electrotechnical Commission (IEC), commemorating the IEC’s centennial and presented for recent major achievement related to the commission’s technical work. As a project leader in IEC SC48B for the development of several cabling connector standards for commercial and industrial data transmission, Mullin completed two critical IEC interface projects: IEC 61076-3-104, characterizing the Category 7/7A connector to 1,000 MHz; and IEC 61076-3-106, the industrial RJ-45 interface specification. Mullin has also been recently appointed to a second four-year term as technical advisor to IEC Technical Committee 48, which is tasked with the standardization of telecommunications and other electric connectors, connecting devices, and mechanical structures that include mechanical housings for connectors, printed circuit boards, and backbone assemblies.
 Jason Brandi |
The electronics group of semiconductor packaging materials developer Henkel (www.electronics.henkel.com) has named Jason Brandi as global product manager for phase-change and thermal adhesives. He will be responsible for introducing new thermal management technologies in tandem with overseeing the company’s current product line. Among Brandi’s top priorities is exploration of new filler technologies to enhance thermal conductivity and flow characteristics to yield superior thermal impedance. “Designers are continuing to develop packages with smaller footprints and increased functionality, which results in higher operating temperatures,” Brandi says. “The management of heat dissipation in advanced devices is a critical issue for electronics manufacturers-more so now than ever.” Before assuming his new role, Brandi served Henkel as technical sales supervisor and thermal materials specialist.
 Les Shutts |
KITCO Fiber Optics (www.kitcofo.com), a provider of fiberoptic connectorization products, training, and consulting services, has named Les Shutts as OEM manager. With more than 15 years of experience in engineering, training, and sales in the telecommunications industry, Shutts has previously served as OEM sales manager and engineering manager for Paladin Tools, electronic engineer designer and sales assistant at Weidmuller Inc., and electronics engineering technician at Harris RF Communications Group. He is a graduate of the State University of New York, College of Technology at Alfred, and served for six years with the Pacific Far East Fleet of the U.S. Navy.
 Esther Murguia |
Fiberoptic connectivity solutions maker Timbercon Inc. (www.timbercon.com) has appointed Esther Murguia as project manager, responsible for the planning, management and operations of key projects and product development opportunities for core product lines. With more than 11 years of experience in project and program management, sales, and customer service, Murguia has served as program manager for RAD Technologies and held field program manager and project manager positions with Jaco Electronics and Arrow Electronics respectively.
Bill MacKillop has joined Cinch Connectors (www.cinch.com) as business development manager. He will be working with the business segment and engineering managers in developing and managing new products and product extensions. MacKillop brings extensive systems architecture knowledge, with a concentration in the telecommunications and aerospace industries. His experience includes technical systems manager at ERNI and principle engineer at Deutsch ECD. MacKillop holds a B.S. in electrical engineering from Northeastern University.
 Dr. Brian Toleno |
Dr. Brian Toleno, a renowned industry materials expert and Henkel (www.electronics.henkel.com) applications engineering team leader, was a keynote speaker at Assembly Technology Expo, held in Chicago in September. Toleno taught a short course on board-level underfills, and presented two papers on the company’s research into lead-free reliability enhancement: “Improved BGA Shock and Bend Performance Using Corner Glue Epoxies (co-authored with Michael Kochanowski from Intel Corp.), and “CSP Solder Joint Drop Test Reliability: Pb-free vs. Sn/Pb and Methods for Reliability Improvements.”
Sunburst Electronics (www.sunburstelectronics.com), a contract manufacturer of electronic assemblies and controls, has fulfilled requirements to become a J-STD-001 facility-a designation that allows the company to expand services to the military and other high-reliability electronics markets (aerospace, medical equipment, and telecommunications). J-STD-011 (Requirements for Soldered Electrical and Electronic Assemblies) is an international credential being referenced on many high-reliability Department of Defense contracts, and is often required for manufacturing electronic controls with minimal failure rates and field lifetimes of 10 to 25 years. “We have witnessed unprecedented growth (averaging 15 percent annually) over the last six years, and anticipate that our J-STD-001 facility designation will put us on an even stronger growth track,” says Dennis Cantoni, vice president of sales and marketing. The company houses its operations in a 31,000-square-foot facility in Erie, PA, and maintains a separately staffed 4,000-square-foot repair center specializing in end-of-life product management.
