SANTA ANA, CA - ITT’s new Cannon Chip on Flex (CoF) filter technology has been designed to virtually eliminate all stress from thermal shock and vibration while providing what the company claims is superior protection to sensitive electronics-all in a new, lighter weight package.
The filter connectors are especially suited for high reliability military, aerospace and industrial applications, including integrated avionics, radio and navigation systems, fire control devices, electronic counter measures, satellite communications and data transmitters. In the MIL-DTL-38999 configurations, the CoF connectors have passed MIL-STD and MIL-DTL Series III testing for thermal shock, random vibration, humidity and high altitude.
The proprietary Cannon CoF design replaces the internal and traditional ceramic planar array block capacitor with a state-of-the-art flexible circuit where individual chip capacitors are surface mounted on a pad adjacent to the feed-through contact. ITT says that since the contacts are not soldered directly to the capacitor, thermal stress points that impact performance in thermal shock and vibration have been virtually eliminated.
 |
In addition, because the flex is significantly lighter, a connector weight reduction of up to 15% is achieved for MIL-DTL-38999 configurations.
The CoF filter approach, says ITT, offers system designers greater flexibility in defining or changing individual circuit capacitance, ground, and EMP performance during the design/development phase-eliminating the need to retool the ceramic planar array.
The Cannon CoF filter connectors provide such standard filtering capabilities as individual isolated pin filtering of high-frequency noise, built-in ground plane barriers in the connector inserts, and filtering at the face of the system boxes.
