LISLE, IL - Molex Incorporated has announced an expanded ability to develop and deliver high-performance flex-circuitry assemblies and now can provide assemblies with up to 18 layer conductive flex. Molex has long been expanding its range of solutions for systems designers.
“Over the last few years, Molex has progressively developed its integrated solutions and test capabilities in all regions,” according to Michael Nauman, president of Molex’s Integrated Products Division. “Then, in October, Molex made a quantum leap forward by acquiring Century Circuits Inc, (CC&E) a Minneapolis-based maker of flex circuitry, specializing in electrically controlled, multi-layer flex-circuit assemblies.”
Molex now has capabilities in the Americas to stamp flex circuitry, automatically circuit-etch, vacuum laminate, and drill multi-layer flex at the tightest tolerances. This complements Molex’s global network of sales and value-add facilities.
The Minneapolis multi-layer flex facility can be control target impedance to as low as ± 5%. Molex can also create a four-mil pitch product for select applications.
Molex’s product lines, technical capabilities, and reputation strengthen CC&E’s role as a supplier of innovative, high-end interconnection products for data communications, medical, and military electronics. CC&E helps Molex add value to customers through integrated solutions and the ability to support new projects from design and prototype through production.
The test capabilities of Molex and Century Circuits combine to provide an improved front-end resource. Molex has a fully integrated state-of-the-art connector test facilities. With CC&E, Molex acquires advanced in-process circuit test strategies. Molex now has advanced vision systems with closed-loop monitoring systems to assure quality at each step of the circuit production process. These vision systems allow for automatic inspection of dimensions and vias and can measure accuracy in skew. The measuring process is operator independent, allowing sustainable quality performance.
The acquisition also advances Molex’s automated X-ray test capabilities and the know how to provide measurement and defect data for every solder joint tested. X-ray test is the only method for finding defects in hidden joints, verifying solder joint quality on BGAs, CCGAs, and other area array components. Hidden through-hole joints and components under shielding are also easily verified with automated X-ray test.
Flex-circuit assemblies are an ideal complement to connectors and have significant synergy with existing Molex membrane switch and printed-circuit-board assembly operations. Molex already provides interconnection solutions combining high-pin-count backplane connectors and sub-millimeter-pitch SMT connectors with flex assemblies.
