Cinch unveils new interconnect technology - Connector Specifier

Cinch unveils new interconnect technology


Dec 1, 2005

By Valerie Coffey

Cinch Connectors (Lombard, IL), a multi-national manufacturer of interconnect products, has recently announced its new “iQ” interconnect technology, which is designed to meet a wide variety of demanding and challenging interconnect requirements. The contact on the connector is a “Q”-shaped beam, assembled in the housing in a way that enables a high amount of flex (see Fig.).

“Its high-speed capabilities and high density of ‘floating’ contacts make it ideal for a wide range of applications, such as land-grid-array (LGA), flex circuits, board-to-board, and component-to-board types,” said Kevin Honan, Z-axis product manager at Cinch. The proprietary technology involves an innovative Q-shaped contact that offers a 0.032" low profile with a large working range (derived from the amount of spring in the contact). The extra flex optimizes mechanical and electrical performance.

Designed for versatility, these mechanical and electrical characteristics of the iQ technology give it advantages for challenging high-speed CPU/ASIC-to-board designs. Its robust interface and ability to support high I/O and high-density configurations are an inherent match for high-speed flex applications where reliability, flexibility, and low-profile characteristics are critical.


In a typical connector for a CPU or ASIC chip (right), “iQ” technology has a bellow beam on the top of the “Q”-shaped contact (above), designed to mate with smooth vias in a printed circuit board (no holes) to protect the contact surface, while the lower “cobra-head” contact touches across the hole in more cost-effective in-pad vias.
Click here to enlarge image

For board-to-board applications, a low profile and reasonable mating tolerances are key. In both areas, the iQ technology is well suited, and the low compression forces and high-speed capabilities are especially important for component-to-board applications.

Versatility

The new iQ technology lends itself to a variety of interconnect applications. The 0.032" profile results in short signal paths with low self-inductance of less than 0.6 nH and low resistance of 12 mΩ. A short signal path minimizes crosstalk, resulting in a near-end crosstalk of 1.3% to 4%. Low compression force reduces stress on mating components, and high-density pin-out as low as 1.0 mm saves board space in large arrays. The large working range accommodates greater system non-planarities. In addition, the unique floating contacts can shift to adjust for uneven planarities, allowing greater tolerances for all applications.

Cinch is currently incorporating the iQ technology into several unique customer applications. Cinch Connectors is a supplier to the computer, datacom, telecom, mil/aero, and transportation industries.


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