Web seminar discusses halogen-free materials for high-speed, high-density interconnects - Connector Specifier

Web seminar discusses halogen-free materials for high-speed, high-density interconnects


Oct 19, 2011

A seminar hosted by Interconnection World and presented via the web will discuss, among other interconnect-related topics, the use of halogen-free materials as fire retardants. Sponsored and presented by Ticona, the seminar will focus on the use of liquid crystal polymer (LCP) as a material in the manufacture of interconnect devices across multiple applications.

The seminar will include a quote from University of California Berkeley biophysical chemist Arlene Blum, who told Environmental Health Perspectives, "Instead of adding new fire retardant chemicals that ultimately may be shown to cause health problems, we should be asking whether we need to use these chemicals or if there are other ways to achieve equivalent fire safety. So many of the chemicals we have banned in the past were flame retardants ... We need to think carefully about adding these sorts of chemicals to consumer products before there is adequate health information."

The online seminar will contain information on far more than the environmental and health aspects of LCP materials. It will also emphasize the benefits of LCP in interconnect applications that require connectivity technology to accommodate smaller, faster and higher-frequency signal transmission. A description of the seminar on the Inteconnection World website reads in part, "Designers are challenged even more to insure signal integrity for high frequency/high speed interconnects. As bandwidth demands increase along with package density, there is potential for cross talk and signal degradation." It also says, "High temperature resistance, high flow, low mold shrinkage, high stiffness and excellent dimensional stability make LCP a favorite choice to meet the future trends of miniaturization in the electronics industry."

Entitled "LCP for High-Precision, High-Frequency, High-Speed Interconnects," the seminar will take place live at 11:00 am EDT Tuesday, October 25. After its live showing, the seminar will be available for viewing on-demand for six months.

There is no cost to register for the seminar. You can find out more detail about it here or register for it here.


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