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Solder perform terminals from Advanced Interconnections may reduce assembly costs by eliminating time-consuming steps in PC board processing. According to the company, in mixed through-hole and SMT applications, incorporating a solder preform directly on the socket terminal enables use of the existing or traditional stencil design without over-printing, to provide reliable solder joints.
See Also: Integrated preforms streamline soldering
The solder preform now available from Advanced provides a predictable percent of fill and eliminates extra processing steps. The company notes that using a solder preform can often reduce total system processing costs by eliminating the need for wave soldering, solder fountains, or additional solder stencil steps associated with intrusive reflow or pin-in-paste processes.
The solder performs from Advanced are available in standard 63Sn/37Pb or lead-free 95.5Sn/4.0Ag/0.5Cu for RoHS compliant applications. Over 15 standard screw-machined terminals are available with solder performs, and customized designs are available upon request. The solder perform terminals are available on IC sockets and board-to-board connectors in various insulator materials, including high-temperature molded LCP, FR-4, and Peel-A-Way Removable Terminal Carriers.
More Info: www.advanced.com/pgastart.html
