SELF-FUSING TAPE
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This new self-fusing tape is available in six different colors for wire identification. This tape comes in convenient 1” × 20-ft rolls and is used to insulate and protect wires, harnesses, splices, and more. Because it has no adhesive lining, it leaves the application clean, with no sticky residue. This tape is ideal for high- temperature applications (-65° to 500°F). The center ridge of the tape acts as a guide when wrapping for a uniform and straight application. The tape is available in black, red, yellow, green, blue, and gray. WAYTEK, CHANHASSEN, MN
www.waytekwire.com
thermoplastic compound
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This new Ryton polyphenylene sulfide (PPS) engineering thermoplastic, Ryton R-4-260 PPS, provides applications with mechanical strength, toughness, and weld-line integrity. The Ryton R-4-260 PPS is a low-flash and low out-gas grade, and is an ideal candidate for molding electronic components. Applications include desktop and laptop hard-disk-drive connectors and other electronic hard-drive connectors used in the consumer electronics digital-video-recorder and gaming markets. Ryton R-4-260 PPS is an advanced, 40% fiberglass reinforced compound based on Ryton R-4 PPS grade. CHEVRON PHILLIPS CHEMICAL, THE WOODLANDS, TX
www.cpchem.com
NYLON SPACERS/SUPPORTS
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Engineered for board-to-board applications, these durable, long-lasting PCB and chassis nylon spacers/supports either lock-fit, tension-fit, or screw-mount to a PCB or chassis. These devices easily snap into position with a strong, retentive grip, and do not require tools for assembly. They are manufactured in a choice of push-in or screw-mount types and heights from 0.187” (475 mm) to 1.0” (25.4 mm). They feature flame-resistant, one-piece molded nylon material, UL-rated 94V-0 for strength, reliability, and lightest weight, assuring consistent, close tolerance dimensions. KEYSTONE ELECTRONICS, ASTORIA, NY
www.keyelco.com
FIELDLINE MODULAR I/O
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Fieldline modular I/O connects to the most popular fieldbus protocols and provides a cost-effective solution where high concentrations of I/O or a variety of signal types are required. A Fieldline Modular I/O configuration starts with a fieldbus interface module with eight built-in digital inputs. From the interface module, up to 16 self-addressing digital and analog I/O modules can be connected spanning a distance of 20 m. The flexible inter-module connections enable the placement of I/O modules around mechanical restrictions, creating a distributed I/O network that is independent of the fieldbus. PHOENIX CONTACT, HARRISBURG, PA
www.phoenixcon.com
CORD-GRIP FITTINGS
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These multi-hole, cord-grip fittings meet the industry demand for panel connections that are easier and quicker to make, with resultant savings in labor costs and valuable panel space. These multi-hole, nonmetallic cable/cord fittings provide the means of terminating multiple wires into one connector, with a 56% labor cost, as well up to 75% space savings in a panel (based on using one multi-hole connector in the place of three standard connectors in the same panel). They are IP68-rated, UL-listed, and VDE-rated for European applications. THOMAS & BETTS, MEMPHIS, TN
www.tnb.com
WIRE CONNECTORS
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The recently improved O/B+ wire connector is the same small size, but now comes with an increased wire range. The improved spring bites wire quickly with less effort and accommodates from two 22 AWG wires up to three 12 AWG wires or four 14 AWG wires. The small shell fits easily into tight spaces and its flexible skirt helps protect workers from contact with overstripped wires. The wide range of wire enables cost savings via fewer connectors. 3M, AUSTIN, TX
www.3m.com/electrical
multi-use BACKPLANE
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The PICMG 2.18 Serial RapidIO CompactPCI backplane is available in 8 and 21 slots with two PICMG 2.18 fabric slots. Custom configurations from 2 to 21 slots are also available. The backplane features a 12-layer, high-performance, low-noise stripline design, and it is available in 5- or 3.3-V switchable V (I/O). It has a jumperable geographic address and type AB rear shrouds on RP3, and RP5 on node slots. The PICMG 2.18 backplane efficiently transfers large amounts of data between cards, with an emphasis on real-time applications that require low latency. HYBRICON, AYER, MA
www.hybricon.com
RETENTION MECHANISM
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A board-level retention mechanism has been developed for PCI Express graphics cards that protects against electrical interrupts and mechanical damage caused by system-level shocks and vibration. A deep slot in the retention mechanism restrains the graphics card during side-shock events. A flexible arm extends away from the slot and includes a molded post that snaps into a notch on the bottom of the add-in card. The device solders to the motherboard adjacent to the x16 PCI Express card-edge connector in desktop PCs and workstations. FCI, ETTERS, PA
www.fciconnect.com
ADAPTERS
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QFN/MLF programming adapters are available in body sizes from 3 × 3- to 15 × 15-mm, pin counts from 8- to 84-pin, and lead pitches of 0.50-, 0.65-, 0.80-, and 1.27-mm. The QFN/MLF package is smaller and thinner than other similar leaded packages. With a lead frame on the bottom of the package, it provides thermal performance and minimal self-inductance. The adapter serves multiple roles for design engineers as the signal mapping enables it to be used for QFN/MLF prototyping, quality, and reliability testing for the chip package. EMULATION TECHNOLOGY, SANTA CLARA, CA
www.1800adapter.com
INTERFACE MODULES
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A new range of front-panel interface products with IP65 protection feature transparent, slim profile frames with thousands of modular insert combinations. The MODLINK MSDD offers an ideal solution for power and data access without opening the control panel. The interface modules allow laptops, programming and diagnostic devices, networks, or modems to be connected easily without ever opening the control panel. The transparent cover with separate lockable lids allows a clear view of signal indicators and data connectors within the cabinet. MURRELEKTRONIK, DULUTH, GA
www.murrinc.com
CENTER PROBE SOCKETS
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This solderable center probe socket enables users to debug a wide range of package types-BGA, UBGA, MLF, QFN, and others-on the same package footprint. The surface-mount adapter securely connects to standard center probe test sockets, providing a quick and highly reliable package test on populated PC boards. The debugging socket provides 0.060” (1.52 mm) clearance for 0.80-mm and higher package pitches. The socket pressure mounts to the adapter, which is soldered to the pre-existing PCB footprint via standard reflow process. The socket features an insertion loss of only 1 dB up to 5 GHz. ARIES ELECTRONICS, FRENCHTOWN, NJ
www.arieselec.com
BGA SOCKETS
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The new high-performance SG-BGA-7026 socket allows use of 0.5-mm-pitch, 11 × 11-mm-body ICs without compromising performance in high-speed computing and communication applications. The new 10+ GHz bandwidth sockets easily support dense BGA stacked devices using a high-performance conductive elastomer contact. The contact resistance is normally 10 mΩ. The precision design of the sockets guides the IC to the exact position for connection of each ball and uses an aluminum heat-sink screw to provide compressive force. IRONWOOD ELECTRONICS, EAGAN, MN
www.ironwoodelectronics.com
CABLE PREP TOOLs
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The new cable prep tool, the ST-240EZ (3190-1722) prep/strip tool, is for use with its LMR-240 low-loss coaxial cables. The new cable prep tool prepares the cable to the exact dimensions in one step, facilitating field installation of the EZ no-solder connectors available for LMR-240. The tool uses case-hardened carbon steel blades for long service life. TIMES MICROWAVE SYSTEMS, WALLINGFORD, CT
www.timesmicrowave.com
INTERCONNECT SYSTEM
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The new TelEnable fax/data card (FDC) interconnect system provides communications interoperability between legacy, current, and future technologies for a variety of applications. These include wireless communication, transportation, emergency medical system, and remote monitoring applications. The TelEnable FDC transmits serial data or a digital fax from an analog device via a wireless network, thereby eliminating the extra steps and technology normally needed to make these devices “talk” to each other. By sending information directly to a device, the TelEnable FDC simplifies design issues by providing an interface for new protocols and enabling compatibility between existing technologies. MOLEX, LISLE, IL
www.molex.com
PATCH PANELS
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These high-density, GigaBand category 6 and MegaBand 5e patch panels support 48 ports in one rack unit. The panels are designed to provide high performance in half the space of a typical 48-port panel. Robust and easy to install, these panels feature a built-in rear cable-management design that enables each cable to be secured to the back of the panel, allowing for the neat routing of cables and secure terminations. The performance of these patch panels exceeds the latest specifications covering hardware, link, and channel performance. HELLERMAN TYTON, MILWAULKEE, WI
www.hellerman.tyton.com
OVER-MOLDED CABLES
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The over-molded RJ45 system cables, designed for an industrial environment, are a quick solution. The system cables, 100% tested and built with RJ-45 connectors on both ends, make a field assembly unnecessary. Based on the existing RJ Industrial range’s modular concept, the over-molded RJ Industrial IP20 emphasizes the advantages of the fieldpatch connector. The data connector is already the smallest Ethernet connector that is able to work with 22 AWG cables using the IDC technology. The over-molded version requires less space. In order to ensure additional flexibility, the system cables are offered in various lengths. HARTING, ELGIN, IL
www.harting.com
SIGNAL CONTACTS
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These Type III+ enhanced high-current signal contacts are crimp-style contacts suitable for use in circular plastic, M Series, and METRIMATE connectors. Compared to standard Type III+ contacts, Enhanced Type III+ contacts offer an additional 8 A of current-carrying capacity for a single contact under identical testing conditions. This additional 47% of current-carrying capacity allows engineers to more efficiently package power into existing connector housings without compromising temperature rise. In some cases, Enhanced Type III+ contacts may allow engineers to use a smaller connector housing to improve power density. TYCO ELECTRONICS, HARRISBURG, PA
www.tycoelectronics.com
SHIELDING SLEEVES
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This cost-effective, EMI-protection shielded sleeving for flat cables allows for easy cable routing during assembly. The sleeving material is a highly conductive Amucor film, offering full 360° protection against radiation. Shielding performance can be improved using optional terminating earthing connections. For moving and/or bending flat cables, this flexible solution with conductive textile, as well as self-adhesiveness, offers mechanical and screening properties. This sleeve is also available for round cables with diameters up to 45 mm on 100-m rolls. HOLLAND SHIELDING SYSTEMS, DORDRECHT, NETHERLANDS
www.hollandshielding.com
